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MC10H123FN

Onsemi

MC10H123FN by Onsemi

MC10H123FN by Onsemi is a Bus Driver & Transceiver with 1.6 ns Propagation Delay, -5.2V Power Supplies, and ECL Technology. It has 20 terminals in a SQUARE CHIP CARRIER package style for high-speed data transmission applications. The device operates b/w 0-75 °C temperature range making it suitable for commercial extended grade environments.

Median Price

$1.359

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,850 parts In-Stock

1+ parts

-

100+ parts

$1.280

1k+ parts

$1.150

10k+ parts

$1.080

4,850

-

$1.280

$1.150

$1.080

Verical

USA . 4,823 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.438

10k+ parts

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4,823

-

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$1.438

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Flip Electronics (Authorized)

USA . 3,592 parts In-Stock

1+ parts

-

100+ parts

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3,592

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Distributors (In-Stock)

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Digiode

USA . 979 parts In-Stock

1+ parts

$1.358

100+ parts

-

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979

$1.358

-

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Vyrian

USA . 772 parts In-Stock

1+ parts

$1.430

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772

$1.430

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Ace Electronics

USA . 67 parts In-Stock

1+ parts

$7.500

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67

$7.500

-

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DigiKey Marketplace

USA . 4,862 parts In-Stock

1+ parts

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4,862

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Flip Electronics

USA . 3,492 parts In-Stock

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3,492

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Bristol Electronics

USA . 500 parts In-Stock

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500

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Prism Electronics

USA . 226 parts In-Stock

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226

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Lighthouse Electronics, Inc.

USA . 196 parts In-Stock

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196

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Resion

USA . 131 parts In-Stock

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J & M Industries LLC

USA . 80 parts In-Stock

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80

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A2Z Electronics, Inc.

USA . 24 parts In-Stock

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24

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,695 parts In-Stock

1+ parts

$1.287

100+ parts

-

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1,695

$1.287

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Corohmni

South Africa . 59 parts In-Stock

1+ parts

$1.430

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59

$1.430

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QUARKTWIN TECHNOLOGY LTD

USA . 20,855 parts In-Stock

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20,855

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SupplyDigital Components

Austria . 7,829 parts In-Stock

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7,829

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Problanco Electronics

Mexico . 7,727 parts In-Stock

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7,727

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Continental Prestige Electronics

USA . 4,862 parts In-Stock

1+ parts

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$1.240

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4,862

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$1.240

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Kulean Microsystems

USA . 4,842 parts In-Stock

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4,842

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 2,517 parts In-Stock

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2,517

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UHIMA Technologies

Türkiye . 914 parts In-Stock

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914

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Perfect Parts

USA . 258 parts In-Stock

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258

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Microchip USA

USA . 114 parts In-Stock

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114

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Overview

Enhance your electronic designs with the MC10H123FN bus driver & transceiver by Onsemi. With a reputation for high-quality products, Onsemi delivers top-notch performance and reliability. This versatile chip carrier package offers fast propagation delay, open-emitter output characteristics, and true output polarity, making it ideal for a wide range of applications. Experience the value of seamless communication and efficient signal transmission with the MC10H123FN, designed to meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 1.7 ns

Low propagation delay ensures fast and efficient data transmission.

Surface Mount: YES

Surface mount capability makes it easy to integrate into various electronic systems.

No. of Functions: 3

Multiple functions allow for versatile usage in bus driver and transceiver applications.

Package Shape: SQUARE

Square package shape facilitates easy placement and integration onto circuit boards.

Power Supplies (V): -5.2

Suitable power supply voltage for efficient operation in bus driver and transceiver setups.

No. of Terminals: 20

Sufficient number of terminals for connecting to various components and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compact size for space-constrained designs.

Propagation Delay (tpd): 1.6 ns

Very low propagation delay ensures high-speed data transmission in bus driver and transceiver applications.

Maximum Operating Temperature: 75 °C

Wide operating temperature range suitable for various environmental conditions.

Output Characteristics: OPEN-EMITTER WITH CUT-OFF

Open-emitter output characteristic with cut-off feature for precise signal control and manipulation.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for reliable performance even in cold environments.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good conductivity and solderability for easy installation.

Terminal Position: QUAD

Quad terminal position offers stable connection points for secure signal transmission.

No. of Ports: 2

Two ports for connecting to multiple devices or systems simultaneously.

Maximum Seated Height: 4.57 mm

Low seated height for space-saving installation in compact electronic setups.

Width: 8.965 mm

Compact width for easy integration and placement on circuit boards.

Output Polarity: TRUE

True output polarity ensures accurate signal representation and manipulation.

Peak Reflow Temperature °C: 235

High peak reflow temperature for secure solder joints and reliable connections during assembly.

Length: 8.965 mm

Compact length for space-efficient design and installation in electronic systems.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade suitable for a range of operating conditions in commercial applications.

Technology: ECL

ECL technology for high-speed digital circuitry in bus driver and transceiver functions.

Terminal Form: JBEND

JBend terminal form for secure connections and easy installation in electronic setups.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with existing electronic components and systems.

Technical Specifications

Bus Driver & Transceivers MC10H123FN attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

WITH 4-3-3 INPUT NOR FUNCTION

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

3

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER WITH CUT-OFF

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Propagation Delay At Nominal Supply:

1.7 ns

Propagation Delay (tpd):

1.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.57 mm

Sub-Category:

Gates

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10H123FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-392-7517, 5962013927517

NIIN

013927517

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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