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MC10H123FNR2G

Onsemi

MC10H123FNR2G by Onsemi

MC10H123FNR2G by Onsemi is a Bus Driver & Transceiver with 1.7 ns Propagation Delay, -5.2V Power Supplies, and ECL Technology. It has 20 terminals in a SQUARE CHIP CARRIER package style and is ideal for high-speed communication applications requiring fast signal propagation.

Median Price

$2.722

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 3,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,592

-

-

-

-

Rochester

USA . 2,215 parts In-Stock

1+ parts

-

100+ parts

$2.570

1k+ parts

$2.300

10k+ parts

$2.160

2,215

-

$2.570

$2.300

$2.160

Verical

USA . 1,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.875

10k+ parts

-

1,340

-

-

$2.875

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,962 parts In-Stock

1+ parts

$2.717

100+ parts

-

1k+ parts

-

10k+ parts

-

1,962

$2.717

-

-

-

Component Electronics Inc.

Canada . 22 parts In-Stock

1+ parts

$3.080

100+ parts

$2.310

1k+ parts

$2.000

10k+ parts

-

22

$3.080

$2.310

$2.000

-

Vyrian

USA . 6,374 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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6,374

-

-

-

-

Flip Electronics

USA . 3,492 parts In-Stock

1+ parts

-

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-

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3,492

-

-

-

-

NAC Semi

USA . 415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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415

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-

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Bristol Electronics

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 64 parts In-Stock

1+ parts

$2.574

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$2.574

-

-

-

Corohmni

South Africa . 349 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

-

349

$2.860

-

-

-

Component Stockers USA

USA . 2,326 parts In-Stock

1+ parts

$2.940

100+ parts

$2.760

1k+ parts

$2.500

10k+ parts

-

2,326

$2.940

$2.760

$2.500

-

AZTECH Wire

Italy . 1,093 parts In-Stock

1+ parts

$13.650

100+ parts

-

1k+ parts

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10k+ parts

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1,093

$13.650

-

-

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Kulean Microsystems

USA . 3,772 parts In-Stock

1+ parts

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100+ parts

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3,772

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-

-

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SupplyDigital Components

Austria . 3,549 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,549

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-

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Problanco Electronics

Mexico . 2,781 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,781

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-

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TANS Electronics

Latvia . 2,349 parts In-Stock

1+ parts

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100+ parts

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2,349

-

-

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Continental Prestige Electronics

USA . 2,215 parts In-Stock

1+ parts

-

100+ parts

$2.480

1k+ parts

-

10k+ parts

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2,215

-

$2.480

-

-

UHIMA Technologies

Türkiye . 877 parts In-Stock

1+ parts

-

100+ parts

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877

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Microchip USA

USA . 303 parts In-Stock

1+ parts

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303

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Kepictronics

USA . 147 parts In-Stock

1+ parts

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147

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Overview

Unlock the power of seamless communication with the MC10H123FNR2G by Onsemi. As a leader in the industry, Onsemi delivers top-quality products that are trusted by professionals worldwide. This bus driver & transceiver is perfect for a variety of applications, providing fast and reliable performance. With a focus on value and innovation, this product offers customers unparalleled benefits and advantages, making it a must-have for any project. Experience the difference with Onsemi and see the difference in your projects today.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY material makes the product lightweight and durable, ideal for use in buses and vehicles where weight and durability are important.

Propagation Delay At Nominal Supply

With a low propagation delay of 1.7 ns, this product offers fast signal transmission, ensuring efficient communication in bus driver systems.

Surface Mount

The surface mount feature allows for easy installation and compact design, making it suitable for space-constrained environments like buses.

No. of Functions

Having 3 functions in a single component adds versatility and functionality to the product, making it a cost-effective choice for bus driver applications.

Package Shape

The SQUARE package shape provides a stable and secure fit, minimizing the risk of damage during operation in a bus driver system.

Power Supplies (V)

Operating at -5.2V, this product is designed to work efficiently with standard power sources commonly found in bus driver systems.

No. of Terminals

Having 20 terminals allows for multiple connections and interfaces, enabling seamless integration with other components in a bus driver setup.

Package Style (Meter)

The CHIP CARRIER package style offers a compact form factor, saving space and facilitating easy installation in bus driver applications.

Minimum Operating Temperature

With a minimum operating temperature of 0 °C, this product can withstand typical temperature variations in bus environments without performance degradation.

Terminal Finish

The MATTE TIN finish provides corrosion resistance and conductivity, ensuring reliable connections in bus driver systems for long-term use.

Technical Specifications

Bus Driver & Transceivers MC10H123FNR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

WITH 4-3-3 INPUT NOR FUNCTION

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

3

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER WITH CUT-OFF

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Propagation Delay At Nominal Supply:

1.7 ns

Propagation Delay (tpd):

1.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.57 mm

Sub-Category:

Gates

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10H123FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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