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MC100LVE164FAR2G

Onsemi

MC100LVE164FAR2G by Onsemi

MC100LVE164FAR2G by Onsemi is a 16-input multiplexer with 0.85 ns propagation delay at 3.3V, suitable for industrial applications. It features ECL technology, operates b/w -40 to 85 °C, and has a low profile flatpack package style.

Median Price

$12.475

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,122 parts In-Stock

1+ parts

-

100+ parts

$9.980

1k+ parts

$8.930

10k+ parts

$8.400

4,122

-

$9.980

$8.930

$8.400

DigiKey

USA . 4,122 parts In-Stock

1+ parts

-

100+ parts

$13.130

1k+ parts

-

10k+ parts

-

4,122

-

$13.130

-

-

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$12.475

1k+ parts

$11.162

10k+ parts

$10.500

2,000

-

$12.475

$11.162

$10.500

Distributors (In-Stock)

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Digiode

USA . 1,036 parts In-Stock

1+ parts

$10.564

100+ parts

-

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1,036

$10.564

-

-

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Vyrian

USA . 3,121 parts In-Stock

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3,121

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PC Components Company LLC

USA . 1,955 parts In-Stock

1+ parts

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1,955

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Bristol Electronics

USA . 1,955 parts In-Stock

1+ parts

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1,955

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 284 parts In-Stock

1+ parts

$9.610

100+ parts

-

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284

$9.610

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Corphita

USA . 292 parts In-Stock

1+ parts

$10.008

100+ parts

-

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292

$10.008

-

-

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AZTECH Wire

Italy . 869 parts In-Stock

1+ parts

$10.670

100+ parts

-

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869

$10.670

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QUARKTWIN TECHNOLOGY LTD

USA . 26,307 parts In-Stock

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26,307

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SupplyDigital Components

Austria . 8,148 parts In-Stock

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Kulean Microsystems

USA . 7,572 parts In-Stock

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7,572

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TANS Electronics

Latvia . 4,190 parts In-Stock

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4,190

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Continental Prestige Electronics

USA . 4,122 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$9.610

10k+ parts

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4,122

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$9.610

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Problanco Electronics

Mexico . 490 parts In-Stock

1+ parts

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490

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UHIMA Technologies

Türkiye . 281 parts In-Stock

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281

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Microchip USA

USA . 153 parts In-Stock

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153

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Overview

Experience unparalleled performance and reliability with the MC100LVE164FAR2G by Onsemi, a leading manufacturer in the industry. This multiplexer & demultiplexer offers lightning-fast signal processing with a propagation delay of just 0.85 ns, making it ideal for high-speed applications. With 16 inputs and a nominal supply voltage of 3.3V, this product ensures seamless operation and exceptional output characteristics. Enhance your projects with the quality and precision of Onsemi's MC100LVE164FAR2G, providing unmatched value and efficiency to customers looking for top-tier electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, making the product sturdy and easy to handle.

Propagation Delay At Nominal Supply: 0.85 ns

Fast propagation delay ensures quick and efficient data transmission.

Surface Mount: YES

Easy to mount on circuit boards, saving time and effort during installation.

No. of Inputs: 16

Provides ample input options for versatile use in a variety of applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage ensuring compatibility with most systems.

Output Characteristics: OPEN-EMITTER

Offers flexibility in configuring output connections based on specific requirements.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with the ability to withstand varying temperature conditions.

Technology: ECL

Uses Emitter-Coupled Logic technology for high-speed and reliable performance.

Technical Specifications

Multiplexer & Demultiplexer MC100LVE164FAR2G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE=-3V TO -3.8

Family:

100LVE

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inputs:

16

No. of Outputs:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Maximum Power Supply Current (ICC):

45 mA

Propagation Delay At Nominal Supply:

.85 ns

Propagation Delay (tpd):

.85 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

MC100LVE164FAR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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