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MC100EP57MNG

Onsemi

MC100EP57MNG by Onsemi

MC100EP57MNG by Onsemi is a 4-input multiplexer with 0.52 ns propagation delay at 3.3V, operating b/w -40 to 85 °C. It features ECL technology, complementary output polarity, and rail packing method. Ideal for industrial applications requiring fast signal switching in compact designs.

Median Price

$10.438

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 92 parts In-Stock

1+ parts

$11.550

100+ parts

$8.930

1k+ parts

$8.140

10k+ parts

$7.720

92

$11.550

$8.930

$8.140

$7.720

DigiKey

USA . 81 parts In-Stock

1+ parts

$13.180

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$13.180

-

-

-

Rochester

USA . 8,436 parts In-Stock

1+ parts

-

100+ parts

$7.460

1k+ parts

$6.670

10k+ parts

$6.280

8,436

-

$7.460

$6.670

$6.280

Verical

USA . 3,588 parts In-Stock

1+ parts

-

100+ parts

$9.325

1k+ parts

$8.338

10k+ parts

$7.850

3,588

-

$9.325

$8.338

$7.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,141 parts In-Stock

1+ parts

$7.885

100+ parts

-

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-

1,141

$7.885

-

-

-

Nova Conductors

Japan . 83 parts In-Stock

1+ parts

$13.737

100+ parts

-

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-

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83

$13.737

-

-

-

Vyrian

USA . 5,092 parts In-Stock

1+ parts

-

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5,092

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Flip Electronics

USA . 4,876 parts In-Stock

1+ parts

-

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4,876

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NAC Semi

USA . 26 parts In-Stock

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26

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K-1 Technologies

USA . 18 parts In-Stock

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,717 parts In-Stock

1+ parts

$7.470

100+ parts

-

1k+ parts

-

10k+ parts

-

1,717

$7.470

-

-

-

Corohmni

South Africa . 277 parts In-Stock

1+ parts

$8.300

100+ parts

-

1k+ parts

-

10k+ parts

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277

$8.300

-

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Component Stockers USA

USA . 7,332 parts In-Stock

1+ parts

$8.530

100+ parts

$8.020

1k+ parts

$7.260

10k+ parts

-

7,332

$8.530

$8.020

$7.260

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$18.317

100+ parts

$16.668

1k+ parts

$15.020

10k+ parts

-

2,500

$18.317

$16.668

$15.020

-

Continental Prestige Electronics

USA . 8,496 parts In-Stock

1+ parts

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8,496

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Kulean Microsystems

USA . 7,716 parts In-Stock

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7,716

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SupplyDigital Components

Austria . 7,608 parts In-Stock

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7,608

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Problanco Electronics

Mexico . 2,742 parts In-Stock

1+ parts

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2,742

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TANS Electronics

Latvia . 2,491 parts In-Stock

1+ parts

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2,491

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UHIMA Technologies

Türkiye . 161 parts In-Stock

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161

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Perfect Parts

USA . 137 parts In-Stock

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137

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Discover the superior performance and reliability of the MC100EP57MNG by Onsemi, a leading manufacturer in the industry. Designed as a Multiplexer & Demultiplexer, this versatile chip carrier with a very thin profile offers a propagation delay of just 0.52 ns, making it ideal for high-speed applications. With a wide temperature range and low power consumption, this innovative solution ensures seamless operation even in the most demanding industrial environments. Upgrade your systems today with the MC100EP57MNG for unmatched efficiency and precision.

Feature Benefit Bullets

Propagation Delay At Nominal Supply

Low propagation delay ensures fast data transmission and high performance.

No. of Inputs

Multiple inputs allow for versatility and flexibility in connecting different sources.

Nominal Supply Voltage / Vsup (V)

Optimal supply voltage for efficient operation and power consumption.

Maximum Operating Temperature

Wide operating temperature range makes it suitable for industrial applications.

Technology

ECL technology offers high-speed operation and low power consumption.

Technical Specifications

Multiplexer & Demultiplexer MC100EP57MNG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V;

Family:

100E

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

65 mA

Propagation Delay At Nominal Supply:

.52 ns

Propagation Delay (tpd):

.475 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

MC100EP57MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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