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MC100EP101MNR4G

Onsemi

MC100EP101MNR4G by Onsemi

MC100EP101MNR4G by Onsemi is a Logic Gates chip with 4 functions and inputs. It has a propagation delay of 0.45 ns at 3.3V, suitable for industrial applications requiring fast signal processing in a compact square package.

Median Price

$10.879

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,663 parts In-Stock

1+ parts

-

100+ parts

$9.670

1k+ parts

$8.650

10k+ parts

$8.140

6,663

-

$9.670

$8.650

$8.140

Verical

USA . 6,663 parts In-Stock

1+ parts

-

100+ parts

$12.088

1k+ parts

$10.813

10k+ parts

$10.175

6,663

-

$12.088

$10.813

$10.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,679 parts In-Stock

1+ parts

$10.232

100+ parts

-

1k+ parts

-

10k+ parts

-

1,679

$10.232

-

-

-

Vyrian

USA . 3,403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,403

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,327 parts In-Stock

1+ parts

$9.150

100+ parts

-

1k+ parts

-

10k+ parts

-

6,327

$9.150

-

-

-

Corphita

USA . 1,004 parts In-Stock

1+ parts

$9.693

100+ parts

-

1k+ parts

-

10k+ parts

-

1,004

$9.693

-

-

-

Corohmni

South Africa . 262 parts In-Stock

1+ parts

$10.770

100+ parts

-

1k+ parts

-

10k+ parts

-

262

$10.770

-

-

-

Component Stockers USA

USA . 5,494 parts In-Stock

1+ parts

$11.150

100+ parts

$10.480

1k+ parts

$9.470

10k+ parts

-

5,494

$11.150

$10.480

$9.470

-

AZTECH Wire

Italy . 278 parts In-Stock

1+ parts

$18.600

100+ parts

-

1k+ parts

-

10k+ parts

-

278

$18.600

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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24,468

-

-

-

-

Microchip USA

USA . 7,834 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,834

-

-

-

-

Continental Prestige Electronics

USA . 6,663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.340

10k+ parts

-

6,663

-

-

$9.340

-

Kulean Microsystems

USA . 4,039 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,039

-

-

-

-

TANS Electronics

Latvia . 3,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,520

-

-

-

-

Problanco Electronics

Mexico . 3,108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,108

-

-

-

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SupplyDigital Components

Austria . 1,856 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,856

-

-

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UHIMA Technologies

Türkiye . 112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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112

-

-

-

-

Overview

Discover the powerful MC100EP101MNR4G by Onsemi, a cutting-edge Logic Gates device that offers lightning-fast performance with a propagation delay of just 0.45 ns. With Onsemi's reputation for high-quality manufacturing, this product is designed for precision and reliability. Whether you're working on telecommunications, data communications, or industrial applications, this versatile chip carrier with a very thin profile will exceed your expectations. Elevate your projects with the superior value, benefits, and advantages that the MC100EP101MNR4G brings to the table.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.45 ns

Low propagation delay ensures fast processing speed, making this product ideal for applications requiring quick response times.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and making manufacturing processes more efficient.

No. of Functions: 4

Having multiple functions in a single component simplifies circuit design and reduces the need for additional components, saving costs and board space.

Nominal Supply Voltage: 3.3V

Operates at a standard supply voltage, making integration with existing systems and power sources seamless.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and is suitable for industrial applications.

Technical Specifications

Logic Gates MC100EP101MNR4G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

4

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

88 mA

Propagation Delay At Nominal Supply:

.45 ns

Propagation Delay (tpd):

.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MC100EP101MNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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