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MC100EP05DG

Onsemi

MC100EP05DG by Onsemi

MC100EP05DG by Onsemi is a logic gate with 2 inputs, 0.27 ns propagation delay, and 3.3V nominal voltage. Ideal for industrial applications requiring fast signal processing in a compact small outline package. With surface mount capability and operating temperature range of -40 to 85 °C, it offers reliable performance in various electronic systems.

Median Price

$7.390

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 7 parts In-Stock

1+ parts

$7.380

100+ parts

-

1k+ parts

-

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7

$7.380

-

-

-

Mouser Electronics

USA . 120 parts In-Stock

1+ parts

$10.660

100+ parts

$7.030

1k+ parts

$6.270

10k+ parts

$6.180

120

$10.660

$7.030

$6.270

$6.180

DigiKey

USA . 79 parts In-Stock

1+ parts

$10.660

100+ parts

$7.124

1k+ parts

$6.590

10k+ parts

$6.463

79

$10.660

$7.124

$6.590

$6.463

Rochester

USA . 31,100 parts In-Stock

1+ parts

-

100+ parts

$5.920

1k+ parts

$5.300

10k+ parts

$4.980

31,100

-

$5.920

$5.300

$4.980

Flip Electronics (Authorized)

USA . 26,748 parts In-Stock

1+ parts

-

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26,748

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Verical

USA . 20,039 parts In-Stock

1+ parts

-

100+ parts

$7.400

1k+ parts

$6.625

10k+ parts

$6.225

20,039

-

$7.400

$6.625

$6.225

Arrow

USA . 278 parts In-Stock

1+ parts

-

100+ parts

$6.128

1k+ parts

$6.014

10k+ parts

-

278

-

$6.128

$6.014

-

Avnet

USA . 98 parts In-Stock

1+ parts

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98

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,136 parts In-Stock

1+ parts

$6.242

100+ parts

-

1k+ parts

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10k+ parts

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1,136

$6.242

-

-

-

TME

Poland . 94 parts In-Stock

1+ parts

$8.460

100+ parts

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94

$8.460

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Flip Electronics

USA . 42,232 parts In-Stock

1+ parts

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42,232

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Vyrian

USA . 4,414 parts In-Stock

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4,414

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NAC Semi

USA . 196 parts In-Stock

1+ parts

-

100+ parts

$13.840

1k+ parts

$12.450

10k+ parts

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196

-

$13.840

$12.450

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Bristol Electronics

USA . 3 parts In-Stock

1+ parts

-

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3

-

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Flex Direct, LLC

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 595 parts In-Stock

1+ parts

$5.913

100+ parts

-

1k+ parts

-

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595

$5.913

-

-

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Corohmni

South Africa . 352 parts In-Stock

1+ parts

$6.570

100+ parts

-

1k+ parts

-

10k+ parts

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352

$6.570

-

-

-

Component Stockers USA

USA . 20,872 parts In-Stock

1+ parts

$6.770

100+ parts

$6.370

1k+ parts

$5.760

10k+ parts

$5.760

20,872

$6.770

$6.370

$5.760

$5.760

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$29.766

100+ parts

$27.087

1k+ parts

$24.408

10k+ parts

-

100

$29.766

$27.087

$24.408

-

Microchip USA

USA . 1,342 parts In-Stock

1+ parts

$33.432

100+ parts

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1,342

$33.432

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Kulean Microsystems

USA . 2,473 parts In-Stock

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2,473

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TANS Electronics

Latvia . 1,927 parts In-Stock

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1,927

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SupplyDigital Components

Austria . 892 parts In-Stock

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892

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Problanco Electronics

Mexico . 642 parts In-Stock

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642

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Allen Electronics Distributors

USA . 454 parts In-Stock

1+ parts

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100+ parts

$8.100

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454

-

$8.100

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Speed Components Ltd (Excess)

Israel . 292 parts In-Stock

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292

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UHIMA Technologies

Türkiye . 245 parts In-Stock

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245

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Perfect Parts

USA . 209 parts In-Stock

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209

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Overview

Unlock the power of precision with the MC100EP05DG by Onsemi. As a leader in logic gates, Onsemi delivers unparalleled quality and reliability for your electronic projects. With a fast propagation delay of just 0.32 ns and a wide operating temperature range, this small outline package is perfect for industrial applications. Experience seamless performance and efficiency with the MC100EP05DG, backed by Onsemi's reputation for excellence. Elevate your designs with this cutting-edge solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 0.32 ns

The low propagation delay ensures fast operation and high-speed performance of the logic gates.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into circuit boards.

No. of Inputs: 2

Having 2 inputs allows for versatile logic operations and functions to be performed.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard electronic devices.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 85°C allows for reliable operation in various environmental conditions.

Maximum Power Supply Current (ICC): 38 mA

With a low power supply current, the logic gates are energy-efficient and suitable for battery-operated devices.

Technical Specifications

Logic Gates MC100EP05DG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

.32 ns

Propagation Delay (tpd):

.27 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100EP05DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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