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MC100E457FNG

Onsemi

MC100E457FNG by Onsemi

MC100E457FNG by Onsemi is a 3-function, 2-input multiplexer with 0.7 ns propagation delay at 5V. It operates in the temperature range of 0-85 °C and has a terminal pitch of 1.27mm. Ideal for high-speed data communication systems requiring fast signal switching.

Median Price

$6.480

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,720 parts In-Stock

1+ parts

$6.480

100+ parts

$6.100

1k+ parts

$5.510

10k+ parts

-

8,720

$6.480

$6.100

$5.510

-

Farnell

UK . 8,720 parts In-Stock

1+ parts

-

100+ parts

$5.350

1k+ parts

-

10k+ parts

-

8,720

-

$5.350

-

-

Verical

USA . 2,183 parts In-Stock

1+ parts

-

100+ parts

$6.938

1k+ parts

$6.200

10k+ parts

$5.838

2,183

-

$6.938

$6.200

$5.838

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,415 parts In-Stock

1+ parts

$5.871

100+ parts

-

1k+ parts

-

10k+ parts

-

1,415

$5.871

-

-

-

Vyrian

USA . 7,565 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,565

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,126 parts In-Stock

1+ parts

$5.250

100+ parts

-

1k+ parts

-

10k+ parts

-

5,126

$5.250

-

-

-

Corphita

USA . 2,033 parts In-Stock

1+ parts

$5.562

100+ parts

-

1k+ parts

-

10k+ parts

-

2,033

$5.562

-

-

-

Corohmni

South Africa . 161 parts In-Stock

1+ parts

$6.180

100+ parts

-

1k+ parts

-

10k+ parts

-

161

$6.180

-

-

-

Component Stockers USA

USA . 7,304 parts In-Stock

1+ parts

$6.330

100+ parts

$5.960

1k+ parts

$5.380

10k+ parts

-

7,304

$6.330

$5.960

$5.380

-

AZTECH Wire

Italy . 491 parts In-Stock

1+ parts

$15.870

100+ parts

-

1k+ parts

-

10k+ parts

-

491

$15.870

-

-

-

Continental Prestige Electronics

USA . 8,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,720

-

-

-

-

TANS Electronics

Latvia . 6,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,271

-

-

-

-

Kulean Microsystems

USA . 3,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,860

-

-

-

-

Problanco Electronics

Mexico . 2,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,004

-

-

-

-

SupplyDigital Components

Austria . 1,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,860

-

-

-

-

Microchip USA

USA . 147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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147

-

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UHIMA Technologies

Türkiye . 121 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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121

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Perfect Parts

USA . 25 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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25

-

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-

-

Overview

Upgrade your electronic projects with the MC100E457FNG by Onsemi, a high-quality multiplexer & demultiplexer chip that guarantees superior performance and reliability. Manufactured by Onsemi, a renowned leader in semiconductor solutions, this versatile component offers fast propagation delay, low power consumption, and wide operating temperature range, making it ideal for a variety of applications. From data communications to industrial automation, this chip delivers exceptional value and efficiency, ensuring that your designs run smoothly and efficiently. Trust the MC100E457FNG to take your projects to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 0.7 ns

Low propagation delay ensures fast data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and simplifying assembly.

No. of Functions: 3

Having multiple functions in one component reduces the need for additional components, saving cost and board space.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with most common electronic systems and power sources.

Width: 11.505 mm

Compact size allows for integration in space-constrained applications without compromising functionality.

Output Polarity: COMPLEMENTARY

Complementary outputs provide signal inversion, enhancing design flexibility and compatibility with various systems.

Technology: ECL

Using Emitter-Coupled Logic technology ensures high-speed operation and low power consumption, making it ideal for critical applications.

Technical Specifications

Multiplexer & Demultiplexer MC100E457FNG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

3

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

127 mA

Propagation Delay At Nominal Supply:

.7 ns

Propagation Delay (tpd):

.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.505 mm

Trade Compliance

MC100E457FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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