Loading...

LV5230LG-TLM-H

Onsemi

LV5230LG-TLM-H by Onsemi

LV5230LG-TLM-H by Onsemi is a BICMOS technology graphics display driver with 49 terminals in a square grid array package. Operating temperature ranges from -30 °C to 85°C, with a supply voltage of 2.6V. Ideal for applications requiring surface mount components and high thermal stability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,255 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,255

-

-

-

-

Digiode

USA . 2,122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,122

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 225 parts In-Stock

1+ parts

$17.650

100+ parts

-

1k+ parts

-

10k+ parts

-

225

$17.650

-

-

-

Kulean Microsystems

USA . 6,519 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,519

-

-

-

-

TANS Electronics

Latvia . 5,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,585

-

-

-

-

Problanco Electronics

Mexico . 3,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,022

-

-

-

-

SupplyDigital Components

Austria . 1,076 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,076

-

-

-

-

UHIMA Technologies

Türkiye . 463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

463

-

-

-

-

Microchip USA

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Corohmni

South Africa . 86 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

86

-

-

-

-

Corphita

USA . 54 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

54

-

-

-

-

Overview

Elevate your display experience with the LV5230LG-TLM-H by Onsemi, a cutting-edge Graphics Display Driver that sets new standards in performance and reliability. Crafted with precision by Onsemi, a renowned leader in semiconductor manufacturing, this device promises unparalleled quality and innovation in every application. Whether you're designing a sleek mobile device, a vibrant digital signage solution, or a futuristic automotive display, this driver offers unmatched value, efficiency, and seamless integration. Embrace the future of visual technology with the LV5230LG-TLM-H and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the package, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape provides a compact and space-saving design, making it ideal for applications with limited space constraints.

Power Supplies (V): 2.6

Operating at a low voltage of 2.6V helps in reducing power consumption and heat dissipation, leading to energy efficiency.

No. of Terminals: 49

Having a high number of terminals allows for a greater degree of connectivity and integration with other components, enhancing functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers improved thermal performance and reliability, making it suitable for demanding applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance and reliability in a variety of environmental conditions.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature enables the product to function effectively even in harsh or extreme temperature conditions.

Technology: BICMOS

Integration of BiCMOS technology allows for enhanced performance, speed, and efficiency, making it a reliable choice for graphics display drivers.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates good resistance to moisture, ensuring durability and reliability in humid environments.

Technical Specifications

Graphics Display Drivers LV5230LG-TLM-H attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

JESD-30 Code:

S-PBGA-N49

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Equivalence Code:

LGA49,7X7,25

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

2.6

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Nominal Supply Voltage:

2.6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Trade Compliance

LV5230LG-TLM-H Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20