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LV5216CS-TE-L-E

Onsemi

LV5216CS-TE-L-E by Onsemi

LV5216CS-TE-L-E by Onsemi is a BICMOS technology graphics display driver with 36 terminals in a square grid array package. Operating b/w -30 to 70 °C, it has a nominal voltage of 5V and peak reflow temperature of 260°C. Ideal for applications requiring fine pitch surface mount components.

Median Price

$1.690

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,803 parts In-Stock

1+ parts

-

100+ parts

$1.690

1k+ parts

$1.510

10k+ parts

$1.420

3,803

-

$1.690

$1.510

$1.420

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,888 parts In-Stock

1+ parts

$1.786

100+ parts

-

1k+ parts

-

10k+ parts

-

1,888

$1.786

-

-

-

Vyrian

USA . 7,870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

7,870

-

-

-

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Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,000

-

-

-

-

Prism Electronics

USA . 1,056 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,056

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,958 parts In-Stock

1+ parts

$1.692

100+ parts

-

1k+ parts

-

10k+ parts

-

1,958

$1.692

-

-

-

Corohmni

South Africa . 259 parts In-Stock

1+ parts

$1.880

100+ parts

-

1k+ parts

-

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259

$1.880

-

-

-

AZTECH Wire

Italy . 773 parts In-Stock

1+ parts

$11.710

100+ parts

-

1k+ parts

-

10k+ parts

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773

$11.710

-

-

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Component Stockers USA

USA . 670 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

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670

$99.990

-

-

-

SupplyDigital Components

Austria . 4,164 parts In-Stock

1+ parts

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4,164

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Kulean Microsystems

USA . 3,148 parts In-Stock

1+ parts

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3,148

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TANS Electronics

Latvia . 3,032 parts In-Stock

1+ parts

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3,032

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Problanco Electronics

Mexico . 3,027 parts In-Stock

1+ parts

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3,027

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Perfect Parts

USA . 1,183 parts In-Stock

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1,183

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UHIMA Technologies

Türkiye . 674 parts In-Stock

1+ parts

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100+ parts

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674

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Microchip USA

USA . 344 parts In-Stock

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344

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Overview

Elevate your display experience with the LV5216CS-TE-L-E by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This graphics display driver is perfect for a wide range of applications, offering unparalleled performance and efficiency. With its advanced technology and innovative design, this product provides customers with exceptional value and benefits. Upgrade your next project with the LV5216CS-TE-L-E and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly onto PCBs, saving time and effort during manufacturing.

Package Shape: SQUARE

The square shape of the package helps in efficient space utilization on the PCB, especially useful in compact designs.

Power Supplies (V): 5

Operating at 5V makes it compatible with a wide range of systems and reduces the need for additional voltage conversion circuits.

No. of Terminals: 36

With 36 terminals, this driver can handle multiple connections and interfaces, making it versatile for various display configurations.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this driver can withstand high temperature environments, ensuring reliability under stress.

Minimum Operating Temperature: -30 °C

The ability to operate in temperatures as low as -30 °C makes this driver suitable for use in a wide range of environmental conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring stable connections over time.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C allows for reliable soldering during the manufacturing process, leading to a robust end product.

Technology: BICMOS

The use of BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V simplifies power management and ensures compatibility with standard power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and compact PCB designs, ideal for space-constrained applications.

Technical Specifications

Graphics Display Drivers LV5216CS-TE-L-E attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

JESD-30 Code:

S-PBGA-B36

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA36,6X6,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LV5216CS-TE-L-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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