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LV5207LP

Onsemi

LV5207LP by Onsemi

LV5207LP by Onsemi is a Graphics Display Driver with 24 terminals in a square chip carrier package. It operates b/w -30 °C to 70°C, with supply voltage ranging from 3V to 4.5V. Ideal for LED display driver applications due to its BICMOS technology and low max supply current of 7mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,005 parts In-Stock

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Vyrian

USA . 1,801 parts In-Stock

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1,801

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Distributors (Availability)

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Problanco Electronics

Mexico . 7,378 parts In-Stock

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7,378

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Kulean Microsystems

USA . 5,587 parts In-Stock

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5,587

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TANS Electronics

Latvia . 5,164 parts In-Stock

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SupplyDigital Components

Austria . 1,914 parts In-Stock

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Corphita

USA . 1,751 parts In-Stock

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1,751

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UHIMA Technologies

Türkiye . 165 parts In-Stock

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Corohmni

South Africa . 156 parts In-Stock

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Overview

Elevate your displays with the LV5207LP by Onsemi, a top-of-the-line graphics display driver that promises superior quality and performance. Designed with precision and expertise by Onsemi, this product offers unmatched reliability and efficiency for all your display needs. Whether you're looking to enhance the visual appeal of your products or streamline your operations, the LV5207LP delivers exceptional value with its advanced technology and seamless integration. Elevate your displays to new heights with the LV5207LP - the ultimate solution for all your graphics display driver requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during production and assembly.

Maximum Supply Voltage: 4.5 V

The high maximum supply voltage of 4.5 V ensures compatibility with a wide range of power sources, providing flexibility in design and application.

Package Shape: SQUARE

The square package shape optimizes space utilization on circuit boards, making it ideal for compact designs and applications with limited space.

No. of Terminals: 24

Having 24 terminals enables versatile connectivity options and functionality, allowing for complex circuit configurations and customization.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced thermal performance and efficient heat dissipation, ensuring stable operation under various conditions.

Minimum Supply Voltage: 3 V

The low minimum supply voltage of 3 V helps in reducing power consumption and extending battery life, making it an energy-efficient choice.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product can withstand high temperatures in demanding environments without compromising performance.

Minimum Operating Temperature: -30 °C

The product's ability to operate at temperatures as low as -30 °C ensures reliable performance in cold or harsh conditions, improving overall durability.

Terminal Position: QUAD

Having a quad terminal position allows for efficient signal routing and connection, contributing to stable communication and data transfer within the system.

Maximum Seated Height: 0.83 mm

The low maximum seated height of 0.83 mm facilitates compact and slim designs, making it suitable for applications where space constraints are a concern.

Width: 3.5 mm

The compact width of 3.5 mm offers space-saving benefits and flexibility in placement within the circuit layout, enabling efficient use of available space.

Length: 3.5 mm

With a length of 3.5 mm, the product's form factor is optimized for compact designs, allowing for versatile placement and integration in various electronic devices.

Technology: BICMOS

The BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed, low power consumption, and improved reliability for enhanced performance.

Terminal Form: NO LEAD

The terminal form without leads reduces the risk of solder joint cracking and improves overall reliability, making it a durable choice for long-term use.

Maximum Supply Current: 7 mA

With a maximum supply current of 7 mA, the product operates efficiently and consumes minimal power, contributing to energy savings and lower operating costs.

Nominal Supply Voltage: 3.7 V

The nominal supply voltage of 3.7 V provides a stable power source for the product, ensuring consistent performance and reliable operation in various applications.

No. of Segments: 7

Having 7 segments allows for versatile display capabilities, making the product suitable for applications requiring multi-segment displays or visual indicators.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables precise and compact connections, supporting high-density integration and enhancing overall design flexibility.

Minimum fmax: 0.6 MHz

With a minimum fmax of 0.6 MHz, the product offers high-speed performance and efficient data processing, making it suitable for applications that require rapid signal processing.

Interface IC Type: LED DISPLAY DRIVER

The interface IC type for LED display driver ensures compatibility with LED displays, allowing for seamless integration and efficient control of LED-based visual interfaces.

Technical Specifications

Graphics Display Drivers LV5207LP attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N24

Length:

3.5 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

7

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.13SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

.83 mm

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3.5 mm

Minimum fmax:

.6 MHz

Trade Compliance

LV5207LP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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