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LV5215LF

Onsemi

LV5215LF by Onsemi

LV5215LF by Onsemi is a BICMOS graphics display driver with 12 terminals in a square chip carrier package. Operating temperature ranges from -30 °C to 70°C, suitable for various applications requiring a 3.7V power supply such as automotive displays and industrial control panels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,827 parts In-Stock

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1,827

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Vyrian

USA . 1,808 parts In-Stock

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1,808

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 6,750 parts In-Stock

1+ parts

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6,750

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TANS Electronics

Latvia . 4,499 parts In-Stock

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4,499

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Corphita

USA . 1,541 parts In-Stock

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1,541

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UHIMA Technologies

Türkiye . 956 parts In-Stock

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956

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Problanco Electronics

Mexico . 900 parts In-Stock

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900

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Corohmni

South Africa . 429 parts In-Stock

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429

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Kulean Microsystems

USA . 346 parts In-Stock

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346

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Overview

Enhance your display experience with the LV5215LF by Onsemi, a top-quality graphics display driver that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted industry leader known for their innovative solutions, this product is designed to meet the highest standards of excellence. Ideal for a wide range of applications, this chip carrier package boasts a nominal supply voltage of 3.7V and operates efficiently in temperatures ranging from -30 °C to 70°C. Elevate your products with the cutting-edge technology and superior features of the LV5215LF, providing customers with exceptional value and benefits. Upgrade your displays today with Onsemi's LV5215LF!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board.

Power Supplies (V): 3.7

The product operates on a power supply of 3.7V, which is suitable for many electronic applications.

No. of Terminals: 12

Having 12 terminals allows for a variety of connections and functionalities in the product.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a compact and efficient way to integrate the product into electronic devices.

Maximum Operating Temperature: 70 °C

The product can operate effectively in temperatures up to 70 °C, making it versatile for different environments.

Minimum Operating Temperature: -30 °C

With a minimum operating temperature of -30 °C, the product can withstand cold conditions.

Terminal Position: QUAD

The quad terminal position offers stability and reliability in connections within the product.

Technology: BICMOS

Utilizing BICMOS technology ensures efficient operation and performance of the product.

Terminal Form: NO LEAD

The no lead terminal form reduces the risk of environmental damage and is more sustainable.

Nominal Supply Voltage: 3.7 V

The nominal supply voltage of 3.7V ensures compatibility with a range of electronic systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch offers precise and compact terminal spacing for effective connections.

Technical Specifications

Graphics Display Drivers LV5215LF attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N12

No. of Terminals:

12

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC12,.08SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.7

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LV5215LF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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