Loading...

LV5207LP-E

Onsemi

LV5207LP-E by Onsemi

LV5207LP-E by Onsemi is a BICMOS LED display driver with 24 terminals. It operates b/w -30 to 70 °C, with supply voltage range of 3-4.5 V and max current of 7 mA. Ideal for graphics displays due to its compact square chip carrier package style and quad terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,470

-

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Digiode

USA . 138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

138

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 534 parts In-Stock

1+ parts

$5.067

100+ parts

-

1k+ parts

-

10k+ parts

-

534

$5.067

-

-

-

Aztec Data Supply Inc.

USA . 4,607 parts In-Stock

1+ parts

$7.750

100+ parts

-

1k+ parts

-

10k+ parts

-

4,607

$7.750

-

-

-

Ampacity Inc.

Singapore . 677 parts In-Stock

1+ parts

$26.500

100+ parts

-

1k+ parts

-

10k+ parts

-

677

$26.500

-

-

-

Component Stockers USA

USA . 569 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

569

$99.990

-

-

-

TANS Electronics

Latvia . 8,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,393

-

-

-

-

Continental Prestige Electronics

USA . 6,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,240

-

-

-

-

Microchip USA

USA . 4,627 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,627

-

-

-

-

SupplyDigital Components

Austria . 4,238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,238

-

-

-

-

Problanco Electronics

Mexico . 1,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,622

-

-

-

-

Argo Parts USA

USA . 815 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

815

-

-

-

-

Corphita

USA . 721 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

721

-

-

-

-

Kulean Microsystems

USA . 720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

720

-

-

-

-

Kepictronics

USA . 459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

459

-

-

-

-

UHIMA Technologies

Türkiye . 448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

448

-

-

-

-

Corohmni

South Africa . 268 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

268

-

-

-

-

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

120

-

-

-

-

Overview

Elevate your display with the LV5207LP-E by Onsemi, a top-tier manufacturer known for their quality and innovation. This LED Display Driver is designed to exceed expectations with its superior performance and reliability. Perfect for a wide range of applications, this product offers unparalleled value and benefits, making it the ideal choice for all your graphics display needs. Upgrade to the LV5207LP-E and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the display driver.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 4.5 V

The high maximum supply voltage of 4.5 V ensures compatibility with a wide range of power sources, making the display driver versatile and adaptable.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, maximizing the number of components that can be housed in a limited area.

Power Supplies (V): 3.7

The power supply voltage of 3.7 V provides stable and reliable operation for the display driver, ensuring consistent performance.

No. of Terminals: 24

With 24 terminals, the display driver can accommodate a large number of connections, allowing for complex display configurations and versatile applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and lightweight, making the display driver suitable for portable devices and applications where space is limited.

Minimum Supply Voltage: 3 V

The low minimum supply voltage of 3 V allows for efficient power consumption and operation, making the display driver energy-efficient and cost-effective.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the display driver can withstand high temperatures without compromising performance, ensuring reliability in various environmental conditions.

Minimum Operating Temperature: -30 °C

The minimum operating temperature of -30°C allows the display driver to function effectively in cold temperatures, making it suitable for outdoor and industrial applications.

Terminal Position: QUAD

The quad terminal position facilitates easy and secure connection of the display driver to external components, ensuring reliable signal transmission and stable performance.

Maximum Seated Height: 0.83 mm

The low maximum seated height of 0.83 mm allows for a compact and slim profile, making the display driver ideal for thin and lightweight devices.

Width: 3.5 mm

The narrow width of 3.5 mm ensures compatibility with standard spacing requirements on circuit boards, allowing for easy integration of the display driver into existing electronic designs.

Length: 3.5 mm

The compact length of 3.5 mm allows for a space-efficient layout on a circuit board, minimizing the footprint of the display driver and maximizing available space for other components.

Technology: BICMOS

The BICMOS technology used in the display driver combines the advantages of both bipolar and CMOS technologies, enabling high-speed operation, low power consumption, and reliable performance.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of solder joint reliability issues associated with leaded components, ensuring long-term durability and stability for the display driver.

Maximum Supply Current: 7 mA

The low maximum supply current of 7 mA results in efficient power consumption and minimal heat generation, contributing to the overall energy efficiency of the display driver.

Nominal Supply Voltage: 3.7 V

The nominal supply voltage of 3.7 V serves as the standard operating voltage for the display driver, ensuring compatibility with most power sources and reducing the risk of voltage fluctuations.

No. of Segments: 7

With 7 segments, the display driver can control multiple display elements simultaneously, making it suitable for applications requiring complex visual output such as alphanumeric displays or graphical interfaces.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting of the display driver on a circuit board, optimizing space usage and enabling compact electronic designs.

Minimum fmax: 0.6 MHz

The high minimum fmax frequency of 0.6 MHz represents the maximum speed at which the display driver can operate effectively, providing fast and responsive performance for demanding display applications.

Interface IC Type: LED DISPLAY DRIVER

The LED display driver interface IC type ensures compatibility with LED-based display technologies, offering efficient control and management of LED segments or pixels for high-quality visual output.

Technical Specifications

Graphics Display Drivers LV5207LP-E attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N24

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

7

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.13SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.7

Qualification:

Not Qualified

Maximum Seated Height:

.83 mm

Sub-Category:

Display Drivers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3.5 mm

Minimum fmax:

.6 MHz

Trade Compliance

LV5207LP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19