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LV5217GP-TE-L-E

Onsemi

LV5217GP-TE-L-E by Onsemi

LV5217GP-TE-L-E by Onsemi is a BICMOS Graphics Display Driver with 16 terminals, operating b/w -30 °C to 70°C. It has power supplies of 1.8V and 3.7V, suitable for applications requiring surface mount technology in a square chip carrier package style.

Median Price

$1.488

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 161,500 parts In-Stock

1+ parts

-

100+ parts

$1.330

1k+ parts

$1.190

10k+ parts

$1.120

161,500

-

$1.330

$1.190

$1.120

DigiKey

USA . 161,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.540

10k+ parts

$1.540

161,500

-

-

$1.540

$1.540

Verical

USA . 153,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.488

10k+ parts

$1.400

153,500

-

-

$1.488

$1.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,409 parts In-Stock

1+ parts

$1.406

100+ parts

-

1k+ parts

-

10k+ parts

-

2,409

$1.406

-

-

-

Vyrian

USA . 178 parts In-Stock

1+ parts

$1.480

100+ parts

-

1k+ parts

-

10k+ parts

-

178

$1.480

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 475 parts In-Stock

1+ parts

$1.300

100+ parts

-

1k+ parts

-

10k+ parts

-

475

$1.300

-

-

-

Corphita

USA . 1,244 parts In-Stock

1+ parts

$1.332

100+ parts

-

1k+ parts

-

10k+ parts

-

1,244

$1.332

-

-

-

Kepictronics

USA . 197,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

197,500

-

-

-

-

Continental Prestige Electronics

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

$1.410

1k+ parts

-

10k+ parts

-

36,000

-

$1.410

-

-

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,000

-

-

-

-

SupplyDigital Components

Austria . 7,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,239

-

-

-

-

Problanco Electronics

Mexico . 7,233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,233

-

-

-

-

TANS Electronics

Latvia . 7,178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,178

-

-

-

-

Kulean Microsystems

USA . 4,060 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,060

-

-

-

-

UHIMA Technologies

Türkiye . 868 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

868

-

-

-

-

Microchip USA

USA . 113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

113

-

-

-

-

Overview

Unlock the power of high-quality graphics display drivers with the LV5217GP-TE-L-E by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch performance and reliability in their products. This versatile chip carrier package offers a wide range of applications, from automotive displays to industrial equipment. Experience seamless operation with power supplies ranging from 1.8V to 3.7V, all while enjoying the benefits of a compact square design and easy surface mount installation. Elevate your projects with the LV5217GP-TE-L-E and discover the exceptional value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and reliability, making the product resistant to external factors such as heat and moisture.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and time during assembly.

Package Shape: SQUARE

Square package shape provides a compact form factor, optimizing space utilization on the PCB.

Power Supplies (V): 1.8, 3.7

Support for multiple power supply voltages allows flexibility in design and compatibility with different system requirements.

No. of Terminals: 16

Multiple terminals increase connectivity options and enhance functionality, enabling the product to support various input/output connections.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers high thermal performance and efficient heat dissipation, ensuring stable operation under demanding conditions.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures reliable performance even in environments with elevated temperatures, increasing the product's versatility.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows the product to function in cold environments without sacrificing performance, making it suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal position offers stable connectivity and signal transmission, reducing the risk of signal loss or interference.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high-speed operation and low power consumption for efficient performance.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations and promote sustainability, making the product eco-friendly and safe for use.

Terminal Pitch: 0.5 mm

Small terminal pitch facilitates high-density packaging and enables precise alignment with other components, enhancing overall system reliability and performance.

Technical Specifications

Graphics Display Drivers LV5217GP-TE-L-E attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.10SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.8,3.7

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LV5217GP-TE-L-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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