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LV5217GP

Onsemi

LV5217GP by Onsemi

LV5217GP by Onsemi is a graphics display driver with SERIAL data input mode and 16 terminals. It operates at temperatures from -30 to 75 °C, with a max supply voltage of 4.5 V. Ideal for LED displays, this BICMOS technology chip carrier has a square package shape and terminal pitch of 0.5 mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,129 parts In-Stock

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Digiode

USA . 813 parts In-Stock

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813

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Distributors (Availability)

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SupplyDigital Components

Austria . 5,340 parts In-Stock

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5,340

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Problanco Electronics

Mexico . 2,670 parts In-Stock

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2,670

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TANS Electronics

Latvia . 2,030 parts In-Stock

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Kulean Microsystems

USA . 1,485 parts In-Stock

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Corohmni

South Africa . 374 parts In-Stock

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374

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UHIMA Technologies

Türkiye . 291 parts In-Stock

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291

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Corphita

USA . 238 parts In-Stock

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Overview

Enhance your display performance with the LV5217GP by Onsemi. As a leading manufacturer in graphics display drivers, Onsemi ensures top-notch quality and reliability in every product. Ideal for applications requiring high performance and efficiency, this LED display driver offers seamless integration and superior functionality. Unlock the full potential of your designs with the value and benefits that the LV5217GP brings to your projects. Elevate your visual experience and stand out from the competition with this innovative solution.

Feature Benefit Bullets

Data Input Mode: SERIAL

Allows for data to be transferred efficiently and quickly, making it suitable for high-speed applications.

Surface Mount: YES

Enables easy installation and reduces the overall size of the product, saving space on the PCB.

Maximum Supply Voltage: 4.5 V

Provides flexibility in power supply options and supports a wide range of applications.

Package Shape: SQUARE

Optimizes the use of space on the PCB and allows for efficient heat dissipation.

Power Supplies (V): 1.8,3.7

Supports multiple power supply options, enhancing compatibility with different systems.

No. of Terminals: 16

Provides ample connection points for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers versatility in installation methods, catering to various design requirements.

Minimum Operating Temperature: -30 °C

Ensures reliable operation even in extreme temperature conditions, making it suitable for industrial use.

Maximum Seated Height: 0.8 mm

Low profile design allows for compact and slim product designs.

Interface IC Type: LED DISPLAY DRIVER

Specifically designed for driving LED displays, ensuring optimal performance and compatibility.

Technical Specifications

Graphics Display Drivers LV5217GP attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

Length:

2.6 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

3

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.10SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.8,3.7

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.7 V

Maximum Supply Voltage-1:

3 V

Minimum Supply Voltage-1:

1.6 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

2.6 mm

Trade Compliance

LV5217GP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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