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LV5213LP

Onsemi

LV5213LP by Onsemi

LV5213LP by Onsemi is a Graphics Display Driver with SERIAL data input mode. It operates at a max supply voltage of 4.5 V and has 16 terminals in a SQUARE package style. Ideal for LED display driver applications, it features BICMOS technology and can withstand temperatures from -30 to 75 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,048 parts In-Stock

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Digiode

USA . 459 parts In-Stock

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459

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Problanco Electronics

Mexico . 5,414 parts In-Stock

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5,414

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Kulean Microsystems

USA . 5,164 parts In-Stock

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TANS Electronics

Latvia . 4,074 parts In-Stock

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SupplyDigital Components

Austria . 1,448 parts In-Stock

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Corphita

USA . 459 parts In-Stock

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459

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Corohmni

South Africa . 326 parts In-Stock

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326

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UHIMA Technologies

Türkiye . 234 parts In-Stock

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Overview

Elevate your display experience with the LV5213LP by Onsemi, a top-of-the-line graphics display driver that delivers unparalleled quality and performance. Manufactured by the industry-leading Onsemi, this product boasts superior reliability and innovation in its category. Ideal for a wide range of applications, this sleek and compact device offers customers exceptional value, benefits, and advantages. Upgrade your display systems today with the LV5213LP and enjoy a seamless user experience like never before.

Feature Benefit Bullets

Data Input Mode: SERIAL

Serial data input mode allows for easier integration with microcontrollers and other digital systems, providing a simplified and efficient communication process.

Surface Mount: YES

Surface mount capabilities enable easy and compact integration onto circuit boards, saving space and simplifying the design process.

Maximum Supply Voltage: 4.5 V

Ability to support a maximum supply voltage of 4.5V ensures compatibility with a wide range of power sources and operating environments.

Package Shape: SQUARE

Square package shape offers a symmetrical design that simplifies placement and mounting within electronic devices, enhancing overall layout aesthetics.

Power Supplies (V): 1.8,3.6

Support for multiple power supply options (1.8V and 3.6V) provides flexibility in voltage requirements and enables compatibility with various power sources.

No. of Terminals: 16

Having 16 terminals allows for the device to interface with multiple external components, expanding the functionality and connectivity of the product.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offering multiple package styles provides versatility in mounting options, catering to different design needs and preferences.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3V ensures stable operation even under low power conditions, enhancing reliability and performance.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75 °C, the device can withstand elevated temperatures and operate in a wide range of environments without compromising performance.

Minimum Operating Temperature: -30 °C

Ability to operate in temperatures as low as -30 °C ensures the device's functionality in colder climates or harsh conditions, enhancing its reliability in various environments.

Terminal Position: QUAD

Quad terminal position simplifies installation and connection processes, enabling easy and efficient integration within circuitry or systems.

Maximum Seated Height: 0.8 mm

Low maximum seated height of 0.8mm enables a compact and slim form factor, making it suitable for applications where space constraints are a concern.

Width: 2.6 mm

Compact width of 2.6mm allows for a smaller footprint, enabling the device to fit into tight spaces or densely populated circuit boards.

Length: 2.6 mm

Balanced length of 2.6mm ensures a square form factor, providing uniformity and ease of placement during installation or mounting.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable operation over a wider temperature range, making the product suitable for commercial applications in various climates.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, offering high-speed performance and low power consumption for efficient operation.

Terminal Form: NO LEAD

No lead terminal form simplifies the manufacturing process and enhances reliability by eliminating potential lead-related issues such as solder joints.

Nominal Supply Voltage: 3.7 V

Having a nominal supply voltage of 3.7V ensures stable and efficient operation within the recommended voltage range, maximizing performance and longevity.

No. of Segments: 3

With 3 segments, the device can drive multiple independent display segments concurrently, enabling segmented and versatile display options for various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for precise and secure connections, ensuring reliable signal transmission and reducing the risk of electrical interference.

Nominal Supply Voltage-1: 1.8 V

Nominal supply voltage of 1.8V provides additional flexibility for voltage requirements, catering to lower power applications or specific operational needs.

Interface IC Type: LED DISPLAY DRIVER

Designed specifically as an LED display driver, this product can efficiently drive and control LED displays, offering enhanced visual performance and customization options for display applications.

Technical Specifications

Graphics Display Drivers LV5213LP attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

Length:

2.6 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

3

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.8,3.6

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.7 V

Maximum Supply Voltage-1:

3 V

Minimum Supply Voltage-1:

1.6 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

2.6 mm

Trade Compliance

LV5213LP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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