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LV5217GP-E

Onsemi

LV5217GP-E by Onsemi

LV5217GP-E by Onsemi is a BICMOS graphics display driver with 16 terminals in a square chip carrier package. It operates b/w -30°C to 70°C, with power supplies of 1.8V and 3.7V. Ideal for applications requiring surface mount technology and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,378 parts In-Stock

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3,378

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Digiode

USA . 2,053 parts In-Stock

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2,053

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 238 parts In-Stock

1+ parts

$7.500

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238

$7.500

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AZTECH Wire

Italy . 879 parts In-Stock

1+ parts

$11.389

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879

$11.389

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Ampacity Inc.

Singapore . 927 parts In-Stock

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$13.500

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927

$13.500

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Semicontronic

India . 1,598 parts In-Stock

1+ parts

$24.500

100+ parts

$23.888

1k+ parts

$23.765

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1,598

$24.500

$23.888

$23.765

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QUARKTWIN TECHNOLOGY LTD

USA . 25,877 parts In-Stock

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25,877

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Argo Parts USA

USA . 4,063 parts In-Stock

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4,063

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Kulean Microsystems

USA . 1,772 parts In-Stock

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1,772

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Problanco Electronics

Mexico . 1,387 parts In-Stock

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1,387

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Corphita

USA . 1,278 parts In-Stock

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1,278

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Continental Prestige Electronics

USA . 1,203 parts In-Stock

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1,203

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UHIMA Technologies

Türkiye . 971 parts In-Stock

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971

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Kepictronics

USA . 679 parts In-Stock

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679

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Microchip USA

USA . 392 parts In-Stock

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392

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Corohmni

South Africa . 374 parts In-Stock

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374

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SupplyDigital Components

Austria . 281 parts In-Stock

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281

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Bastille Electronics

Australia . 55 parts In-Stock

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55

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TANS Electronics

Latvia . 11 parts In-Stock

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11

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Overview

Enhance your display graphics with the LV5217GP-E by Onsemi, a high-quality graphics display driver designed to deliver exceptional performance and reliability. Manufactured by Onsemi, a trusted name in semiconductor technology, this product offers a range of applications in various industries. With its advanced features and durable construction, customers can expect seamless integration, superior functionality, and long-lasting performance. Elevate your visual experience with the LV5217GP-E and discover the value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and providing a clean and professional look to the final product.

Package Shape: SQUARE

The square package shape simplifies the design and integration process for the product, making it compatible with standard PCB layouts and reducing the risk of errors during installation.

Power Supplies (V): 1.8,3.7

The range of power supplies supported allows for flexibility in different operating environments, providing stable performance under varying voltage conditions.

No. of Terminals: 16

Having 16 terminals enables the product to support a wide range of input/output connections, enhancing compatibility with various devices and systems.

Package Style (Meter): CHIP CARRIER

The chip carrier package style ensures efficient heat dissipation and electromagnetic interference (EMI) shielding, contributing to the overall reliability and performance of the product.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures that the product can function reliably in demanding and high-temperature environments without overheating.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30°C allows the product to operate effectively in cold environments, making it suitable for a wide range of applications.

Terminal Position: QUAD

The quad terminal position design simplifies the installation process and provides a secure and stable connection, reducing the risk of signal loss or interference.

Technology: BICMOS

The use of BICMOS technology combines the advantages of bipolar and CMOS technologies, offering high-speed performance, low power consumption, and enhanced reliability for the product.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of soldering defects, enhances thermal performance, and promotes environmental sustainability by eliminating the use of lead in the manufacturing process.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting of components on the PCB, allowing for compact and space-efficient designs in electronic devices.

Technical Specifications

Graphics Display Drivers LV5217GP-E attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.10SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.8,3.7

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LV5217GP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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