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LV5213LP-TE-L-E

Onsemi

LV5213LP-TE-L-E by Onsemi

LV5213LP-TE-L-E by Onsemi is a BICMOS graphics display driver with 16 terminals in a square chip carrier package. It operates b/w -30 °C to 70°C, with power supplies of 1.8V and 3.7V. Ideal for applications requiring surface mount technology and compact design for graphic displays.

Median Price

$1.413

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$1.260

1k+ parts

$1.130

10k+ parts

$1.060

6,000

-

$1.260

$1.130

$1.060

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.460

10k+ parts

-

6,000

-

-

$1.460

-

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.413

10k+ parts

$1.325

4,000

-

-

$1.413

$1.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,265 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,265

$1.330

-

-

-

Vyrian

USA . 2,107 parts In-Stock

1+ parts

$1.400

100+ parts

-

1k+ parts

-

10k+ parts

-

2,107

$1.400

-

-

-

DigiKey Marketplace

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$1.460

1k+ parts

-

10k+ parts

-

6,000

-

$1.460

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,947 parts In-Stock

1+ parts

$1.260

100+ parts

-

1k+ parts

-

10k+ parts

-

1,947

$1.260

-

-

-

Corohmni

South Africa . 270 parts In-Stock

1+ parts

$1.400

100+ parts

-

1k+ parts

-

10k+ parts

-

270

$1.400

-

-

-

SupplyDigital Components

Austria . 8,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,380

-

-

-

-

TANS Electronics

Latvia . 7,318 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,318

-

-

-

-

Problanco Electronics

Mexico . 3,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,660

-

-

-

-

Kulean Microsystems

USA . 798 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

798

-

-

-

-

UHIMA Technologies

Türkiye . 445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

445

-

-

-

-

Microchip USA

USA . 305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

305

-

-

-

-

Overview

Unlock the potential of your display devices with the LV5213LP-TE-L-E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Graphics Display Drivers that are perfect for a wide range of applications. From enhancing visual experiences to optimizing performance, this product offers unmatched value and benefits to customers. With its innovative technology and reliable construction, the LV5213LP-TE-L-E is a game-changer in the world of graphics display drivers. Upgrade your displays today and experience the difference with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the graphics display driver, making it suitable for various operating environments.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving space and enhancing the overall compactness of the design.

Package Shape: SQUARE

The square package shape ensures uniformity and simplicity in integration with other components on the PCB, optimizing space utilization.

Power Supplies (V): 1.8, 3.7

Supporting multiple power supply options enables flexibility in design and compatibility with different voltage requirements, making it versatile for various applications.

No. of Terminals: 16

Having 16 terminals allows for the connection of multiple input and output signals, facilitating smooth communication between the graphics display driver and other components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers excellent thermal performance and efficient heat dissipation, ensuring reliable operation of the graphics display driver.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the graphics display driver can withstand high thermal loads and operate efficiently in demanding conditions.

Minimum Operating Temperature: -30 °C

The ability to operate at a minimum temperature of -30 °C ensures reliable performance even in extreme cold environments, enhancing the product's usability in various settings.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connection of external devices, improving the overall reliability and stability of the graphics display driver.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance, low power consumption, and improved reliability.

Terminal Form: NO LEAD

The absence of lead terminals reduces the risk of environmental hazards and ensures compliance with RoHS regulations, making the graphics display driver environmentally friendly.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density mounting of the graphics display driver on the PCB, enabling compact and space-efficient designs.

Technical Specifications

Graphics Display Drivers LV5213LP-TE-L-E attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.10SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.8,3.7

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LV5213LP-TE-L-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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