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LV5213LP-E

Onsemi

LV5213LP-E by Onsemi

LV5213LP-E by Onsemi is a BICMOS technology graphics display driver with 16 terminals in a square chip carrier package. It operates b/w -30 °C to 70°C, with power supplies of 1.8V and 3.7V. Ideal for applications requiring surface mountable drivers in electronic displays.

Median Price

$1.525

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 228 parts In-Stock

1+ parts

-

100+ parts

$1.280

1k+ parts

$1.150

10k+ parts

$1.080

228

-

$1.280

$1.150

$1.080

DigiKey

USA . 228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.690

10k+ parts

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228

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-

$1.690

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Verical

USA . 228 parts In-Stock

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-

100+ parts

-

1k+ parts

$1.525

10k+ parts

-

228

-

-

$1.525

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,937 parts In-Stock

1+ parts

$1.358

100+ parts

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1,937

$1.358

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-

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Vyrian

USA . 8,141 parts In-Stock

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8,141

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DigiKey Marketplace

USA . 228 parts In-Stock

1+ parts

-

100+ parts

$1.490

1k+ parts

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228

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$1.490

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,523 parts In-Stock

1+ parts

$1.287

100+ parts

-

1k+ parts

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1,523

$1.287

-

-

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Corohmni

South Africa . 264 parts In-Stock

1+ parts

$1.430

100+ parts

-

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264

$1.430

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Component Stockers USA

USA . 548 parts In-Stock

1+ parts

$1.440

100+ parts

$1.360

1k+ parts

-

10k+ parts

-

548

$1.440

$1.360

-

-

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$13.844

100+ parts

$12.598

1k+ parts

$11.352

10k+ parts

-

350

$13.844

$12.598

$11.352

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Kulean Microsystems

USA . 4,543 parts In-Stock

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4,543

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SupplyDigital Components

Austria . 3,944 parts In-Stock

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3,944

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Problanco Electronics

Mexico . 1,880 parts In-Stock

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1,880

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Kepictronics

USA . 588 parts In-Stock

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588

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UHIMA Technologies

Türkiye . 582 parts In-Stock

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582

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TANS Electronics

Latvia . 475 parts In-Stock

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475

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Overview

Elevate your graphics display experience with the LV5213LP-E by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. Ideal for a wide range of applications, this graphics display driver offers unmatched value and benefits. From its compact chip carrier package to its advanced BICMOS technology, this product delivers exceptional performance in a variety of operating temperatures. Upgrade your display solutions with the LV5213LP-E and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material provides good durability and protection for the graphics display driver, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation of the graphics display driver onto a printed circuit board, saving time and effort during assembly.

Power Supplies (V): 1.8,3.7

Support for multiple power supply voltages ensures compatibility with different systems and versatile deployment options for the graphics display driver.

No. of Terminals: 16

The 16 terminals provide sufficient connectivity options for interfacing with other components and peripherals in a graphics display system, enabling seamless integration.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C allows the graphics display driver to perform reliably in various environmental conditions, enhancing its overall durability.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C ensures that the graphics display driver can function effectively even in cold environments, broadening its range of potential applications.

Technology: BICMOS

The BICMOS technology used in the graphics display driver combines the advantages of both bipolar and CMOS technologies, delivering high performance and efficiency.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for compact packaging of the graphics display driver, saving space on the PCB and enabling sleek and efficient design implementations.

Technical Specifications

Graphics Display Drivers LV5213LP-E attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.10SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.8,3.7

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LV5213LP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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