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LE25U20AFD-AH

Onsemi

LE25U20AFD-AH by Onsemi

LE25U20AFD-AH by Onsemi is a 256Kx8 NOR type flash memory with a small outline, very thin profile package. It operates at a voltage of 2.5V and has a max clock frequency of 30MHz. This memory IC is commonly used in industrial applications requiring high endurance and reliable data storage.

Median Price

$0.744

Lifecycle Status

EOL

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,988 parts In-Stock

1+ parts

$0.490

100+ parts

$0.394

1k+ parts

$0.373

10k+ parts

-

2,988

$0.490

$0.394

$0.373

-

Newark

USA . 7,852 parts In-Stock

1+ parts

$0.730

100+ parts

$0.387

1k+ parts

$0.310

10k+ parts

-

7,852

$0.730

$0.387

$0.310

-

Chip1Stop

Japan . 2,434 parts In-Stock

1+ parts

$0.862

100+ parts

$0.519

1k+ parts

$0.454

10k+ parts

$0.431

2,434

$0.862

$0.519

$0.454

$0.431

Rochester

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$0.759

1k+ parts

$0.630

10k+ parts

$0.562

260

-

$0.759

$0.630

$0.562

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,239 parts In-Stock

1+ parts

$0.592

100+ parts

-

1k+ parts

-

10k+ parts

-

1,239

$0.592

-

-

-

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$0.746

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$0.746

-

-

-

Euro-Tech

UK . 2,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,960

-

-

-

-

Vyrian

USA . 2,501 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,501

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,509 parts In-Stock

1+ parts

$0.530

100+ parts

-

1k+ parts

-

10k+ parts

-

2,509

$0.530

-

-

-

Corphita

USA . 359 parts In-Stock

1+ parts

$0.561

100+ parts

-

1k+ parts

-

10k+ parts

-

359

$0.561

-

-

-

Corohmni

South Africa . 485 parts In-Stock

1+ parts

$0.623

100+ parts

-

1k+ parts

-

10k+ parts

-

485

$0.623

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.731

100+ parts

-

1k+ parts

$0.701

10k+ parts

-

2,000

$0.731

-

$0.701

-

Continental Prestige Electronics

USA . 8,679 parts In-Stock

1+ parts

$0.944

100+ parts

$0.664

1k+ parts

$0.613

10k+ parts

-

8,679

$0.944

$0.664

$0.613

-

Microchip USA

USA . 244 parts In-Stock

1+ parts

$6.500

100+ parts

-

1k+ parts

-

10k+ parts

-

244

$6.500

-

-

-

AZTECH Wire

Italy . 1,169 parts In-Stock

1+ parts

$16.720

100+ parts

-

1k+ parts

-

10k+ parts

-

1,169

$16.720

-

-

-

Problanco Electronics

Mexico . 7,747 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,747

-

-

-

-

TANS Electronics

Latvia . 4,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,635

-

-

-

-

Kulean Microsystems

USA . 3,151 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,151

-

-

-

-

SupplyDigital Components

Austria . 3,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,139

-

-

-

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

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Perfect Parts

USA . 2,352 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,352

-

-

-

-

UHIMA Technologies

Türkiye . 639 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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639

-

-

-

-

Overview

Discover the LE25U20AFD-AH by Onsemi - a high-quality flash memory that exceeds expectations. As a trusted manufacturer, Onsemi delivers exceptional products with precision and expertise. This flash memory offers endless possibilities in applications such as consumer electronics, automotive systems, and industrial equipment. With its small outline and thin profile, it provides efficiency without compromising performance. Benefit from its hardware/software write protection, ensuring your data remains secure. Experience the advantages of this reliable product - value, durability, and versatility. Upgrade your devices with the LE25U20AFD-AH and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the flash memory, making it a reliable choice.

Surface Mount:

YES - The surface mount feature allows for easy installation and integration into electronic devices.

No. of Functions:

1 - This flash memory has a single function, simplifying its usage and making it easy to implement.

Package Shape:

RECTANGULAR - The rectangular shape of the package provides compatibility and flexibility for various applications.

Operating Mode:

SYNCHRONOUS - The synchronous operation mode enables high-speed data transfer, enhancing its overall performance.

Nominal Supply Voltage / Vsup (V):

2.5 - The low nominal supply voltage ensures power efficiency and compatibility with a wide range of systems.

Power Supplies (V):

2.5/3.3 - The compatibility with both 2.5V and 3.3V power supplies offers versatility and adaptability to different devices.

No. of Terminals:

8 - With a small number of terminals, the flash memory is easy to integrate and connect within electronic circuits.

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE - The compact and thin profile of the package enables space-saving designs in electronic devices.

Maximum Operating Temperature:

85 °C - This flash memory can handle high operating temperatures, ensuring reliability in various environments.

Organization:

256KX8 - The organization of 256KX8 provides a large memory capacity and efficient data storage capabilities.

Minimum Operating Temperature:

40 °C - The flash memory can operate in extremely cold temperatures, making it suitable for a wide range of applications.

Terminal Finish:

MATTE TIN - The matte tin finish ensures strong connections and reliable performance in electronic circuits.

Terminal Position:

DUAL - The dual terminal position allows for easy installation and connection options in electronic devices.

Write Protection:

HARDWARE/SOFTWARE - The write protection feature provides data security and prevents unintended data alteration or deletion.

Maximum Seated Height:

0.85 mm - With a low maximum seated height, this flash memory can fit into compact devices and contribute to a streamlined design.

Maximum Clock Frequency (fCLK):

30 MHz - The high maximum clock frequency enables fast data transfer rates and efficient system operation.

Width:

3.9 mm - The compact width of the flash memory allows for flexible integration into small form factor devices.

Minimum Supply Voltage (Vsup):

2.3 V - The minimum supply voltage ensures compatibility with low-power devices and contributes to energy efficiency.

Maximum Time At Peak Reflow Temperature (s):

30 - This flash memory can withstand high reflow temperatures for extended periods, ensuring reliability during manufacturing processes.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature allows for reliable soldering during assembly processes.

Type:

NOR TYPE - The NOR type flash memory offers fast read speeds and random access capabilities, making it suitable for various applications.

Length:

4.9 mm - The compact length of the flash memory allows for flexibility in device design and compatibility with small spaces.

Programming Voltage (V):

3 - The programming voltage of 3V allows for efficient programming and reliable data storage in the flash memory.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade ensures reliable operation in harsh temperature conditions, making it suitable for industrial applications.

Technology:

CMOS - The CMOS technology used in this flash memory offers low power consumption, high performance, and compatibility with various systems.

Parallel or Serial:

SERIAL - The serial communication interface of this flash memory allows for simplified circuit design and efficient data transfer.

Terminal Form:

GULL WING - The gull wing terminal form provides strong mechanical stability and easy soldering, ensuring reliable connections in electronic circuits.

Maximum Supply Current:

15 mA - The low maximum supply current ensures power efficiency and compatibility with energy-conscious devices.

No. of Words:

262144 words - With a large number of words, this flash memory can store and retrieve significant amounts of data efficiently.

Memory Width:

8 - The memory width of 8 provides efficient data storage and retrieval capabilities.

Minimum Data Retention Time:

20 - The flash memory has a minimum data retention time of 20 years, ensuring long-term data integrity and reliability.

Terminal Pitch:

1.27 mm - The terminal pitch of 1.27 mm allows for easy integration and connection with other electronic components and circuits.

No. of Words Code:

256K - With a code for 256K words, this flash memory can handle large amounts of data efficiently.

Moisture Sensitivity Level (MSL):

3 - The moisture sensitivity level of 3 ensures safe storage and durability of the flash memory during handling and assembly processes.

Maximum Supply Voltage (Vsup):

3.6 V - The maximum supply voltage compatibility of 3.6V allows for flexibility and integration with various devices and power sources.

Endurance:

100000 Write/Erase Cycles - This flash memory can endure up to 100,000 write/erase cycles, ensuring long-lasting performance and reliable data storage.

Serial Bus Type:

SPI - The Serial Peripheral Interface (SPI) bus type offers efficient and simplified communication, making it compatible with a wide range of systems.

Memory Density:

2097152 bit - With a high memory density, this flash memory can store a vast amount of data efficiently.

Memory IC Type:

FLASH - As a flash memory IC, it offers non-volatile data storage capability, fast access times, and high reliability.

Maximum Standby Current:

0.00001 Amp - The extremely low maximum standby current ensures minimal power consumption during idle or standby periods, contributing to energy efficiency.

Technical Specifications

Flash Memory LE25U20AFD-AH attributes and parameters. Explore more Flash Memory devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

30 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.85 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

3.9 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

LE25U20AFD-AH Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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