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LC88FC3K0AUTJ-2H

Onsemi

LC88FC3K0AUTJ-2H by Onsemi

LC88FC3K0AUTJ-2H by Onsemi is a 16-bit microcontroller with 786432 ROM words, 48640 RAM bytes, and 16-Ch 12-Bit ADC channels. Ideal for industrial applications, it features peripherals like POR, PWM(2), RTC, TIMER(9), WDT and connectivity options such as I2C(3), SIO(3), UART(3).

Median Price

$6.970

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 896 parts In-Stock

1+ parts

$6.970

100+ parts

$4.865

1k+ parts

$4.600

10k+ parts

-

896

$6.970

$4.865

$4.600

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,245 parts In-Stock

1+ parts

$7.372

100+ parts

-

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2,245

$7.372

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Flip Electronics

USA . 23,400 parts In-Stock

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23,400

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Vyrian

USA . 2,225 parts In-Stock

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2,225

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Distributors (Availability)

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Corphita

USA . 1,362 parts In-Stock

1+ parts

$6.984

100+ parts

-

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1,362

$6.984

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Corohmni

South Africa . 86 parts In-Stock

1+ parts

$7.760

100+ parts

-

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86

$7.760

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QUARKTWIN TECHNOLOGY LTD

USA . 15,270 parts In-Stock

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15,270

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Microchip USA

USA . 8,716 parts In-Stock

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8,716

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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SupplyDigital Components

Austria . 2,585 parts In-Stock

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2,585

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Kulean Microsystems

USA . 2,193 parts In-Stock

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2,193

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Problanco Electronics

Mexico . 2,127 parts In-Stock

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2,127

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TANS Electronics

Latvia . 879 parts In-Stock

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879

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UHIMA Technologies

Türkiye . 148 parts In-Stock

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148

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Overview

Discover the LC88FC3K0AUTJ-2H by Onsemi, a cutting-edge microcontroller that delivers unmatched quality and performance. With a wide range of applications in various industries, this innovative product showcases the superior craftsmanship of its manufacturer, Onsemi. Offering customers exceptional value and benefits, the LC88FC3K0AUTJ-2H provides seamless connectivity, precision control, and reliable operation. Experience the advantages of this microcontroller today and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Allows for higher input voltage tolerance, providing flexibility in power supply options.

Bit Size: 16

Higher bit size allows for more complex operations and calculations, making the microcontroller suitable for a wide range of applications.

ROM Words: 786432

Large ROM capacity allows for storing a significant amount of program data and instructions.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast processing speed, making the microcontroller efficient in handling tasks.

RAM Bytes: 48640

Ample RAM capacity provides sufficient memory for temporary data storage, improving overall performance.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple ADC channels with high resolution enable accurate conversion of analog signals to digital data, making the microcontroller suitable for sensor applications.

Connectivity: I2C(3), SIO(3), UART(3)

Various connectivity options enable easy communication with external devices, expanding the microcontroller's capabilities.

Technical Specifications

Microcontrollers LC88FC3K0AUTJ-2H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO AVAILABLE ADC WITH 16-CH 8-BIT

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

90

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

48640

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

10 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), SIO(3), UART(3)

Peripherals:

POR, PWM(2), RTC, TIMER(9), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

LC88FC3K0AUTJ-2H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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