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LC88F40H0PAU

Onsemi

LC88F40H0PAU by Onsemi

LC88F40H0PAU by Onsemi is a 16-bit microcontroller with 524288 ROM words and 30720 RAM bytes. It operates at a max clock frequency of 2 MHz, suitable for industrial applications requiring PWM channels and ADC functionality. With a package style of FLATPACK, it offers a wide temperature range from -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,487 parts In-Stock

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Vyrian

USA . 53 parts In-Stock

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Kulean Microsystems

USA . 4,992 parts In-Stock

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4,992

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Problanco Electronics

Mexico . 2,418 parts In-Stock

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Corphita

USA . 2,075 parts In-Stock

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TANS Electronics

Latvia . 2,035 parts In-Stock

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SupplyDigital Components

Austria . 994 parts In-Stock

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994

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UHIMA Technologies

Türkiye . 875 parts In-Stock

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Corohmni

South Africa . 362 parts In-Stock

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Overview

Experience next-level performance and reliability with the LC88F40H0PAU by Onsemi, a top-tier manufacturer in the industry. This microcontroller is designed for a wide range of applications, offering unmatched value and benefits to customers. With its high-quality construction and advanced features, this product ensures seamless operation and superior functionality. Upgrade your projects with the LC88F40H0PAU and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the microcontroller a reliable choice for various applications.

Surface Mount: YES

Surface mount technology enables easy installation and soldering, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller is suitable for low voltage applications, ensuring efficient power consumption.

Bit Size: 16

The 16-bit architecture allows for higher precision and performance compared to lower bit microcontrollers.

Power Supplies (V): 3.3,3.3/5

Support for multiple power supply options gives flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 100

Having a high number of terminals allows for more connectivity options and peripherals to be integrated with the microcontroller.

Maximum Clock Frequency: 2 MHz

The high maximum clock frequency of 2MHz enables fast processing speeds, suitable for applications requiring real-time data processing.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it is designed to provide a wide range of functionalities and features, making it versatile for various applications.

Technical Specifications

Microcontrollers LC88F40H0PAU attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

2 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

No. of I/O Lines:

86

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.67X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

RAM Bytes:

30720

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

3 mm

Speed:

2 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LC88F40H0PAU Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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