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LC88F52H0AU-CH-H

Onsemi

LC88F52H0AU-CH-H by Onsemi

The Onsemi LC88F52H0AU-CH-H is a 16-bit microcontroller with 524288 ROM words and 24576 RAM bytes. It operates in industrial temperature range (-40 to 85 °C) and has a max supply current of 19.2 mA. Ideal for applications requiring high-speed processing and low power consumption in a compact square package.

Median Price

$8.500

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$6.800

1k+ parts

$6.090

10k+ parts

$5.730

90

-

$6.800

$6.090

$5.730

DigiKey

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$8.950

1k+ parts

-

10k+ parts

-

90

-

$8.950

-

-

Verical

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$8.500

1k+ parts

$7.612

10k+ parts

$7.162

90

-

$8.500

$7.612

$7.162

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,155 parts In-Stock

1+ parts

$7.562

100+ parts

-

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2,155

$7.562

-

-

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Chip Stock

USA . 51,000 parts In-Stock

1+ parts

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51,000

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Vyrian

USA . 10,883 parts In-Stock

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10,883

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DigiKey Marketplace

USA . 90 parts In-Stock

1+ parts

-

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90

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,833 parts In-Stock

1+ parts

$7.164

100+ parts

-

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-

10k+ parts

-

1,833

$7.164

-

-

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Corohmni

South Africa . 344 parts In-Stock

1+ parts

$7.880

100+ parts

-

1k+ parts

-

10k+ parts

-

344

$7.880

-

-

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Microchip USA

USA . 959 parts In-Stock

1+ parts

$20.384

100+ parts

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959

$20.384

-

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TANS Electronics

Latvia . 6,707 parts In-Stock

1+ parts

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6,707

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Kulean Microsystems

USA . 6,531 parts In-Stock

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6,531

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SupplyDigital Components

Austria . 6,221 parts In-Stock

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6,221

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Problanco Electronics

Mexico . 3,497 parts In-Stock

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3,497

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UHIMA Technologies

Türkiye . 92 parts In-Stock

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92

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Continental Prestige Electronics

USA . 90 parts In-Stock

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90

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Overview

Unlock the power of innovation with the LC88F52H0AU-CH-H microcontroller by Onsemi. Designed to deliver top-notch performance and reliability, this product boasts a wide range of applications in various industries. With its cutting-edge technology and industrial-grade quality, customers can expect seamless integration and exceptional functionality. Experience the benefits of this microcontroller and stay ahead in today's competitive market. Choose Onsemi for unmatched value and superior products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, saving time during assembly.

Bit Size: 16

16-bit processing capability allows for more complex and advanced operations, making the microcontroller suitable for a wide range of applications.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V and 5V) provides flexibility in designing and integrating the microcontroller into various systems.

No. of Terminals: 100

Having 100 terminals allows for more connections and interfaces, enabling the microcontroller to interact with a variety of external devices and components.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and space-saving design, which is beneficial for applications where size constraints are a concern.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the microcontroller can withstand harsh environmental conditions and operate reliably in industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures that the microcontroller can function effectively even in extreme cold conditions.

RAM Bytes: 24576

With a large RAM capacity of 24576 bytes, the microcontroller can handle and process data efficiently, facilitating smooth operation and multitasking.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the microcontroller energy-efficient and reliable.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the microcontroller's firmware, ensuring adaptability and future-proofing.

Technical Specifications

Microcontrollers LC88F52H0AU-CH-H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

16

JESD-30 Code:

S-PQFP-G100

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

19.2 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC88F52H0AU-CH-H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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