Loading...

LC88F83B0AUC-X1

Onsemi

LC88F83B0AUC-X1 by Onsemi

LC88F83B0AUC-X1 by Onsemi is a 16-bit microcontroller with 131072 ROM words, 4240 RAM bytes, and 20 I/O lines. It operates at a max clock frequency of 4 MHz and has PWM channels for versatile applications in commercial-grade temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 30,872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,872

-

-

-

-

Vyrian

USA . 5,398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,398

-

-

-

-

Digiode

USA . 81 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

81

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,311 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,311

$10.000

-

-

-

AZTECH Wire

Italy . 921 parts In-Stock

1+ parts

$15.030

100+ parts

-

1k+ parts

-

10k+ parts

-

921

$15.030

-

-

-

Component Stockers USA

USA . 533 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

533

$99.990

-

-

-

Kulean Microsystems

USA . 7,711 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,711

-

-

-

-

TANS Electronics

Latvia . 4,864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,864

-

-

-

-

SupplyDigital Components

Austria . 4,838 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,838

-

-

-

-

Problanco Electronics

Mexico . 3,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,460

-

-

-

-

Corphita

USA . 1,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,305

-

-

-

-

UHIMA Technologies

Türkiye . 911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

911

-

-

-

-

Microchip USA

USA . 353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

353

-

-

-

-

Corohmni

South Africa . 345 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

345

-

-

-

-

Overview

Unleash the power of innovation with the LC88F83B0AUC-X1 by Onsemi! This cutting-edge microcontroller is designed to deliver top-notch performance and reliability, making it the perfect choice for a wide range of applications. With its advanced features and high-quality construction, customers can trust that this product will exceed their expectations. Experience seamless operation and unmatched efficiency with the LC88F83B0AUC-X1 - the ultimate solution for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount design makes the microcontroller easy to install and saves space on the PCB.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, offering flexibility in power options.

Bit Size: 16

With a 16-bit architecture, the microcontroller can perform complex operations and calculations efficiently.

Power Supplies (V): 2.5/5

Supports multiple power supply options, enabling compatibility with different power sources.

No. of Terminals: 120

The high number of terminals allows for versatile connectivity and integration in various circuit designs.

Minimum Supply Voltage: 2.3 V

Can operate at low supply voltage levels, conserving power and extending battery life.

ADC Channels: YES

Integrated ADC channels enable analog input capabilities, essential for sensor interfacing and data acquisition.

ROM Words: 131072

Large ROM capacity provides ample space for program code storage, accommodating complex algorithms and applications.

Maximum Clock Frequency: 4 MHz

High clock frequency allows for fast and responsive processing, suitable for real-time applications.

RAM Bytes: 4240

Sufficient RAM capacity for temporary data storage and efficient program execution.

PWM Channels: YES

PWM channels facilitate precise control of analog outputs, ideal for applications requiring variable speed or intensity.

ROM Programmability: FLASH

Flash ROM enables easy reprogramming of the microcontroller without needing specialized equipment, simplifying updates and debugging.

Technical Specifications

Microcontrollers LC88F83B0AUC-X1 attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

4 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Length:

14 mm

No. of I/O Lines:

20

No. of Terminals:

120

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

RAM Bytes:

4240

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

4.19 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LC88F83B0AUC-X1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19