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LC88F52H0A

Onsemi

LC88F52H0A by Onsemi

The Onsemi LC88F52H0A is a 16-bit microcontroller with DAC and ADC channels, 524288 ROM words, and 24576 RAM bytes. It operates at a max clock frequency of 12 MHz and has a temperature range of -40 to 85 °C. Ideal for industrial applications requiring precise control and data processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,467 parts In-Stock

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Vyrian

USA . 459 parts In-Stock

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Kulean Microsystems

USA . 6,398 parts In-Stock

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TANS Electronics

Latvia . 3,319 parts In-Stock

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Problanco Electronics

Mexico . 2,501 parts In-Stock

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Corphita

USA . 1,971 parts In-Stock

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SupplyDigital Components

Austria . 941 parts In-Stock

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UHIMA Technologies

Türkiye . 881 parts In-Stock

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881

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Corohmni

South Africa . 239 parts In-Stock

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Overview

Discover the LC88F52H0A by Onsemi, a high-quality microcontroller designed for a wide range of applications. With Onsemi's reputation for excellence in manufacturing, this product promises reliability and performance. Ideal for industrial use, this microcontroller boasts advanced features such as DAC and ADC channels, PWM channels, and a ROM programmability of 524288 words. Experience the value and benefits of this versatile product, offering customers a competitive edge in their projects. Elevate your designs with the LC88F52H0A from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy installation on circuit boards and saves space in the design.

Maximum Supply Voltage: 5.5 V

Can handle a relatively high supply voltage, providing flexibility in power supply options.

Bit Size: 16

With a larger bit size, this microcontroller can handle more complex calculations and operations.

DAC Channels: YES

Includes Digital-to-Analog Converter channels, allowing for analog output signals.

No. of Terminals: 100

Provides ample connection points for interfacing with external components and peripherals.

Minimum Supply Voltage: 4.5 V

Operates efficiently even at lower supply voltages, saving power.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, suitable for industrial environments.

ADC Channels: YES

Includes Analog-to-Digital Converter channels, allowing for analog input signals to be processed.

ROM Words: 524288

Large ROM capacity for storing program instructions and data.

RAM Bytes: 24576

Provides sufficient memory for storing and processing data during operation.

Maximum Clock Frequency: 12 MHz

Operates at a high clock frequency, enabling fast processing speeds.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

PWM Channels: YES

Includes Pulse Width Modulation channels for precise control of analog output signals.

Technical Specifications

Microcontrollers LC88F52H0A attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 2 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

12 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

90

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

19 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LC88F52H0A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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