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LC88F58B0A

Onsemi

LC88F58B0A by Onsemi

LC88F58B0A by Onsemi is a 16-bit microcontroller with 131072 ROM words and 6144 RAM bytes. It operates at a max clock frequency of 12 MHz, suitable for industrial applications requiring high-speed processing. With 54 I/O lines and PWM channels, it offers versatile connectivity options in a compact FLATPACK package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,905 parts In-Stock

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Vyrian

USA . 969 parts In-Stock

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969

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SupplyDigital Components

Austria . 6,465 parts In-Stock

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TANS Electronics

Latvia . 2,856 parts In-Stock

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Corphita

USA . 2,139 parts In-Stock

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Kulean Microsystems

USA . 1,527 parts In-Stock

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Problanco Electronics

Mexico . 602 parts In-Stock

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Corohmni

South Africa . 487 parts In-Stock

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UHIMA Technologies

Türkiye . 459 parts In-Stock

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Overview

Discover the LC88F58B0A by Onsemi, a top-notch microcontroller designed to deliver exceptional performance and reliability in various applications. Manufactured by industry leader Onsemi, this microcontroller offers cutting-edge technology and innovative features that set it apart from the competition. With its advanced capabilities and versatile design, the LC88F58B0A is the perfect solution for your electronic projects, providing unmatched value and benefits to customers seeking high-quality components for their applications. Experience the difference with Onsemi's LC88F58B0A microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and helps in reducing the overall weight of the product.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient assembly process.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Bit Size: 16

Provides sufficient data processing capabilities for a wide range of applications.

Power Supplies (V): 2.5/5

Compatible with multiple power supply options, enhancing versatility.

No. of Terminals: 64

Sufficient number of terminals for connecting various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact package style saves space, making it suitable for applications with size constraints.

Minimum Supply Voltage: 4.5 V

Can operate at low voltages, ensuring efficiency in power consumption.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can function in extreme cold conditions, enhancing reliability in diverse environments.

ADC Channels: YES

Integrated Analog-to-Digital Converter allows for processing analog signals, increasing functionality.

Terminal Position: QUAD

Quad terminal position enables efficient routing of connections, optimizing PCB layout.

ROM Words: 131072

Large ROM capacity for storing program code and data, accommodating complex applications.

Maximum Seated Height: 1.7 mm

Low profile design enables space-saving installation, suitable for compact devices.

Width: 10 mm

Narrow width facilitates placement in tight spaces, ideal for applications with limited board area.

Maximum Clock Frequency: 12 MHz

High clock frequency enables fast data processing, enhancing overall performance.

Length: 10 mm

Compact length contributes to a small form factor, perfect for miniaturized designs.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation.

Peripheral IC Type: MICROCONTROLLER

Incorporates various peripherals for enhanced functionality and system integration.

RAM Bytes: 6144

Sufficient RAM capacity for temporary data storage, supporting multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving energy efficiency.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder connections, ensuring robust electrical connections.

Maximum Supply Current: 17.5 mA

Low supply current requirement helps in minimizing power consumption, ideal for battery-powered devices.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage for consistent performance and compatibility with standard power sources.

PWM Channels: YES

Integrated Pulse Width Modulation channels for precise control over connected devices, enhancing flexibility.

ROM Programmability: FLASH

Flash ROM allows for reprogramming of firmware, enabling firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density packaging, suitable for space-constrained designs.

Speed: 12 rpm

Operates at a speed of 12 rotations per minute, providing efficient processing capabilities.

No. of I/O Lines: 54

Abundance of I/O lines for interfacing with external devices, expanding connectivity options.

Technical Specifications

Microcontrollers LC88F58B0A attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.2V MINIMUM SUPPLY AT 2 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

54

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

17.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LC88F58B0A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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