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LC88F52H0AU-TQFP-H

Onsemi

LC88F52H0AU-TQFP-H by Onsemi

LC88F52H0AU-TQFP-H by Onsemi is a 16-bit microcontroller with 524288 ROM words and 24576 RAM bytes. Ideal for industrial applications, it operates b/w -40 to 85 °C, with a max supply current of 19.2 mA. Its quad-terminal position and flash ROM programmability make it suitable for various electronic designs.

Median Price

$8.680

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$7.500

1k+ parts

$6.710

10k+ parts

$6.310

90

-

$7.500

$6.710

$6.310

DigiKey

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$9.860

1k+ parts

-

10k+ parts

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90

-

$9.860

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,167 parts In-Stock

1+ parts

$7.914

100+ parts

-

1k+ parts

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1,167

$7.914

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Vyrian

USA . 6,784 parts In-Stock

1+ parts

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6,784

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,517 parts In-Stock

1+ parts

$7.497

100+ parts

-

1k+ parts

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1,517

$7.497

-

-

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Corohmni

South Africa . 191 parts In-Stock

1+ parts

$8.330

100+ parts

-

1k+ parts

-

10k+ parts

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191

$8.330

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$54.700

100+ parts

$49.777

1k+ parts

$44.854

10k+ parts

-

5,000

$54.700

$49.777

$44.854

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TANS Electronics

Latvia . 6,484 parts In-Stock

1+ parts

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6,484

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Problanco Electronics

Mexico . 4,789 parts In-Stock

1+ parts

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4,789

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SupplyDigital Components

Austria . 3,502 parts In-Stock

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3,502

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Kulean Microsystems

USA . 1,142 parts In-Stock

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1,142

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UHIMA Technologies

Türkiye . 363 parts In-Stock

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363

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Overview

Unlock the power of advanced technology with the LC88F52H0AU-TQFP-H microcontroller by Onsemi. Crafted with precision and expertise, this innovative product offers a seamless blend of quality and performance. Ideal for a wide range of applications, this microcontroller boasts a 16-bit size and impressive ROM words of 524288. With a temperature grade of industrial and a maximum operating temperature of 85 °C, this product ensures reliability and durability in every use. Experience the value and benefits of cutting-edge technology with the LC88F52H0AU-TQFP-H microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Bit Size: 16

The 16-bit size offers enhanced performance and processing capabilities.

Power Supplies (V): 3/5

Support for multiple power supplies (3V and 5V) allows for flexibility in power options.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with external components.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile design, saving space on the PCB.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can withstand high temperature environments.

Minimum Operating Temperature: -40 °C

The product can operate in low temperature environments down to -40 °C.

Terminal Finish: Tin/Bismuth (Sn/Bi)

This terminal finish provides good solderability and durability for reliable connections.

Terminal Position: QUAD

The quad terminal position offers efficient layout and wiring options on the PCB.

ROM Words: 524288

With a ROM size of 524288 words, the product offers ample storage capacity for program instructions.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments.

RAM Bytes: 24576

Having 24576 bytes of RAM allows for efficient data processing and storage capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical and electrical connections on the PCB.

Maximum Supply Current: 19.2 mA

The maximum supply current of 19.2 mA ensures efficient power usage and prevents overheating.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible updates to the program code.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch enables high density mounting and space-saving on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has moderate sensitivity to moisture, suitable for standard PCB handling procedures.

Technical Specifications

Microcontrollers LC88F52H0AU-TQFP-H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

524288

ROM Programmability:

FLASH

Sub-Category:

Microcontrollers

Maximum Supply Current:

19.2 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC88F52H0AU-TQFP-H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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