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LC88F83B0A

Onsemi

LC88F83B0A by Onsemi

LC88F83B0A by Onsemi is a 16-bit microcontroller with 131072 ROM words and 4240 RAM bytes. It operates at a max clock frequency of 4 MHz, suitable for applications requiring PWM channels and ADC channels. The package style is flatpack, thin profile, fine pitch, making it ideal for compact designs in commercial extended temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,557 parts In-Stock

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Digiode

USA . 245 parts In-Stock

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TANS Electronics

Latvia . 7,897 parts In-Stock

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SupplyDigital Components

Austria . 5,615 parts In-Stock

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Kulean Microsystems

USA . 3,278 parts In-Stock

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Problanco Electronics

Mexico . 1,666 parts In-Stock

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UHIMA Technologies

Türkiye . 882 parts In-Stock

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Corphita

USA . 372 parts In-Stock

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Corohmni

South Africa . 126 parts In-Stock

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Overview

Experience the cutting-edge technology of the LC88F83B0A microcontroller by Onsemi. With its high-quality manufacturing and innovative features, this product offers unmatched performance in a variety of applications. From industrial automation to consumer electronics, this microcontroller delivers reliable and efficient operation. Trust Onsemi to provide you with a superior product that brings value and benefits to your projects. Experience the difference with the LC88F83B0A microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Facilitates easy and efficient installation onto circuit boards, saving time and effort.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of power supply options, increasing flexibility in design.

Bit Size: 16

Provides a good balance between performance and complexity for various applications.

No. of Terminals: 120

Offers a sufficient number of connections for interfacing with external components and peripherals.

Minimum Supply Voltage: 2.3 V

Ensures compatibility with lower voltage power sources, enhancing versatility.

ADC Channels: YES

Enables analog-to-digital conversion, allowing the microcontroller to process analog signals.

ROM Words: 131072

Provides ample memory for storing program instructions and data, accommodating complex algorithms.

RAM Bytes: 4240

Offers sufficient memory for temporary data storage and efficient operation of the microcontroller.

Maximum Clock Frequency: 4 MHz

Supports high-speed processing of instructions, improving overall performance.

Temperature Grade: COMMERCIAL EXTENDED

Suitable for a wide range of operating temperatures in commercial applications, ensuring reliability.

PWM Channels: YES

Allows for the generation of pulse-width modulation signals, useful for controlling motor speeds.

ROM Programmability: FLASH

Enables reprogrammability of the read-only memory, making firmware updates and modifications easier.

Technical Specifications

Microcontrollers LC88F83B0A attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

4 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

No. of I/O Lines:

20

No. of Terminals:

120

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP120,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

4240

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

4.19 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LC88F83B0A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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