Loading...

LC88F40D0PA

Onsemi

LC88F40D0PA by Onsemi

LC88F40D0PA by Onsemi is a 16-bit microcontroller with 262144 ROM words and 12288 RAM bytes. Operating at a max clock frequency of 2 MHz, it features 86 I/O lines and PWM channels. Ideal for industrial applications requiring a temperature range of -40 to 85 °C, this microcontroller comes in a flatpack package style with GULL WING terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,417

-

-

-

-

Digiode

USA . 2,014 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,014

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 3,245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,245

-

-

-

-

TANS Electronics

Latvia . 2,946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,946

-

-

-

-

SupplyDigital Components

Austria . 2,244 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,244

-

-

-

-

Corphita

USA . 1,754 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,754

-

-

-

-

UHIMA Technologies

Türkiye . 494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

494

-

-

-

-

Corohmni

South Africa . 312 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

312

-

-

-

-

Problanco Electronics

Mexico . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the LC88F40D0PA microcontroller by Onsemi. Crafted with precision and expertise, this innovative device offers unparalleled performance and reliability. Ideal for a wide range of applications, from electronics to industrial automation, this microcontroller boasts advanced features and capabilities that will elevate your projects to new heights. Experience seamless integration and efficiency like never before with the LC88F40D0PA, where quality meets value for an unbeatable customer experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the microcontroller easier to handle and less prone to damage.

Surface Mount: YES

Surface mount technology allows for easy integration onto a circuit board, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage increases the versatility of the microcontroller in different power supply scenarios.

Package Shape: RECTANGULAR

Rectangular shape provides a standard form factor, making it compatible with a wide range of existing designs and applications.

Bit Size: 16

With a 16-bit architecture, the microcontroller can handle more complex operations and calculations compared to lower bit sizes.

Power Supplies (V): 3.3,3.3/5

Support for multiple power supply options gives flexibility in design and compatibility with different power sources.

No. of Terminals: 100

Having a high number of terminals allows for more connections and peripheral devices to be interfaced with the microcontroller.

Package Style (Meter): FLATPACK

Flatpack style packaging is compact and easily mountable, contributing to space-saving in circuit board designs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and extends the device's operational range.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can function reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this microcontroller suitable for applications in extreme environments.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its potential applications.

Terminal Position: QUAD

Quad terminal position arrangement eases the soldering process and improves the stability of connections on the PCB.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program data, enabling more complex applications on the microcontroller.

Maximum Seated Height: 3 mm

Low seated height enables slim and compact device designs, particularly useful for space-constrained applications.

Width: 14 mm

Compact width makes the microcontroller suitable for small form factor products and space-limited designs.

Maximum Clock Frequency: 2 MHz

High clock frequency allows for faster data processing and execution of instructions, improving overall performance.

Length: 20 mm

Short length contributes to the overall compactness of the microcontroller, facilitating integration into smaller devices or systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh environmental conditions typically encountered in industrial settings.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller itself, the product integrates various peripheral functions required for controlling and interfacing with external devices.

RAM Bytes: 12288

Generous RAM capacity allows for efficient data storage and manipulation during runtime, supporting complex algorithms and multitasking.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull-wing terminal form enhances solder joint strength and reliability, especially beneficial for applications subject to mechanical stress.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller, safeguarding against voltage fluctuations.

PWM Channels: YES

Pulse-width modulation channels enable precise control of output signals, making the microcontroller suitable for motor control and power regulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and efficient reprogramming of the microcontroller without the need for external programming equipment.

Terminal Pitch: 0.65 mm

Narrow terminal pitch aids in miniaturization of circuit board designs and increases potential for high-density interconnections.

Speed: 2 rpm

With a speed rating of 2 revolutions per minute, this microcontroller is suitable for applications requiring precise timing and speed control.

No. of I/O Lines: 86

A high number of I/O lines offers extensive connectivity options and flexibility in interfacing with external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers LC88F40D0PA attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

2 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

No. of I/O Lines:

86

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.67X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

3 mm

Speed:

2 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LC88F40D0PA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20