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LC88F52H0AUTE-2H

Onsemi

LC88F52H0AUTE-2H by Onsemi

LC88F52H0AUTE-2H by Onsemi is a 16-bit microcontroller with 524288 ROM words, 24576 RAM bytes, and 90 I/O lines. It operates at a max clock frequency of 12 MHz and has ADC/DAC channels for industrial applications requiring precise control and data processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,436 parts In-Stock

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Digiode

USA . 482 parts In-Stock

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Component Stockers USA

USA . 731 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 5,824 parts In-Stock

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TANS Electronics

Latvia . 2,944 parts In-Stock

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Kulean Microsystems

USA . 2,374 parts In-Stock

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SupplyDigital Components

Austria . 574 parts In-Stock

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Corohmni

South Africa . 370 parts In-Stock

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Microchip USA

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Corphita

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UHIMA Technologies

Türkiye . 1 parts In-Stock

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Overview

Unlock endless possibilities with the LC88F52H0AUTE-2H microcontroller by Onsemi. Boasting top-notch quality and reliability, this device is designed to meet the highest industry standards. Ideal for a wide range of applications, from automotive to consumer electronics, this powerful microcontroller offers unparalleled performance and efficiency. Experience seamless integration and advanced functionality with the LC88F52H0AUTE-2H, providing you with the competitive edge you need in today's fast-paced market. Elevate your designs with Onsemi's cutting-edge technology and unleash the full potential of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, making it versatile for different power supply configurations.

Bit Size: 16

Offers a good balance between computational power and memory capacity for a wide range of applications.

DAC Channels: YES

Enables the microcontroller to interface with analog devices and sensors, increasing its functionality.

Power Supplies (V): 3/5

Compatibility with both 3V and 5V power supplies allows for flexibility in design and compatibility with various systems.

No. of Terminals: 100

Provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Space-saving design with a fine pitch layout for compact and efficient PCB integration.

Minimum Supply Voltage: 4.5 V

Ensures reliable operation even with lower supply voltages, giving the microcontroller flexibility in power requirements.

Maximum Operating Temperature: 85 °C

Allows the microcontroller to operate in a wide range of temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can withstand low-temperature conditions, making it suitable for harsh environments or outdoor applications.

ADC Channels: YES

Enables analog-to-digital conversion, essential for interfacing with analog signals and sensors.

Terminal Position: QUAD

Quad terminal configuration provides stable connections and reduces the risk of signal interference.

ROM Words: 524288

Large ROM capacity allows for storing a significant amount of program data and instructions.

Width: 14 mm

Compact size for space-constrained designs, ideal for portable or small form-factor devices.

Maximum Clock Frequency: 12 MHz

Offers high-speed processing capabilities, suitable for real-time applications and quick data processing tasks.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial conditions and temperature fluctuations, ensuring reliability in manufacturing environments.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications, providing optimized performance and features for embedded systems.

RAM Bytes: 24576

Sufficient RAM capacity for storing variables and temporary data during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder connections, ensuring a secure electrical connection on the PCB.

Maximum Supply Current: 19.2 mA

Efficient power consumption helps in reducing overall power usage and heat dissipation, ideal for battery-powered devices.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage ensures compatibility with most electronic systems and components.

PWM Channels: YES

Pulse-width modulation (PWM) capability enables precise control of digital signals, useful for motor control and analog output applications.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller firmware, facilitating firmware upgrades and debugging.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density board designs, enabling more compact and efficient circuit layouts.

Speed: 12 rpm

Operates at a speed of 12 revolutions per minute, suitable for applications that require precise timing and control.

No. of I/O Lines: 90

Plenty of I/O lines for interfacing with external devices and peripherals, offering versatility in connectivity options.

Technical Specifications

Microcontrollers LC88F52H0AUTE-2H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

12 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

90

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

19.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LC88F52H0AUTE-2H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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