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LC88F40F0PA

Onsemi

LC88F40F0PA by Onsemi

The Onsemi LC88F40F0PA is a 16-bit microcontroller with 86 I/O lines, 20480 RAM bytes, and 393216 ROM words. It operates at a max clock frequency of 2 MHz and has PWM channels for various applications. Ideal for industrial use with an operating temperature range from -40 °C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,538 parts In-Stock

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Digiode

USA . 1,045 parts In-Stock

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Problanco Electronics

Mexico . 6,509 parts In-Stock

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Kulean Microsystems

USA . 5,132 parts In-Stock

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TANS Electronics

Latvia . 3,352 parts In-Stock

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SupplyDigital Components

Austria . 1,227 parts In-Stock

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Corphita

USA . 585 parts In-Stock

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Corohmni

South Africa . 429 parts In-Stock

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UHIMA Technologies

Türkiye . 124 parts In-Stock

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Overview

Discover the LC88F40F0PA by Onsemi, a top-of-the-line microcontroller designed to elevate your projects to new heights. With a focus on quality and precision, Onsemi has crafted a product that guarantees reliability and performance. Ideal for a wide range of applications, this microcontroller offers unparalleled value with its advanced features and capabilities. Whether you're a seasoned professional or a hobbyist looking to take your creations to the next level, the LC88F40F0PA is sure to impress with its superior benefits and advantages. Explore endless possibilities with this cutting-edge technology from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Provides a higher voltage tolerance, increasing the versatility of the product in different applications.

Bit Size: 16

Offers a good balance between processing power and complexity, making it suitable for a wide range of tasks.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it combines the functions of a processor and peripheral interfaces in a single chip, making it a cost-effective solution for embedded systems.

RAM Bytes: 20480

Provides ample space for storing and manipulating data during operation, enhancing the performance of the product.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the product to interface with sensors and other analog devices.

Technical Specifications

Microcontrollers LC88F40F0PA attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

2 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

No. of I/O Lines:

86

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.67X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

3 mm

Speed:

2 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LC88F40F0PA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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