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LC88F40F0PAU

Onsemi

LC88F40F0PAU by Onsemi

LC88F40F0PAU by Onsemi is a 16-bit microcontroller with 393216 ROM words and 20480 RAM bytes. Operating at a max clock frequency of 2 MHz, it features 86 I/O lines and PWM channels. Ideal for industrial applications requiring a temperature range of -40 to 85 °C, this microcontroller comes in a flatpack package style with gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,119 parts In-Stock

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Vyrian

USA . 584 parts In-Stock

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584

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Problanco Electronics

Mexico . 7,164 parts In-Stock

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7,164

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SupplyDigital Components

Austria . 6,054 parts In-Stock

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TANS Electronics

Latvia . 4,482 parts In-Stock

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Kulean Microsystems

USA . 1,885 parts In-Stock

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Corphita

USA . 817 parts In-Stock

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817

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UHIMA Technologies

Türkiye . 327 parts In-Stock

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Corohmni

South Africa . 245 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the LC88F40F0PAU microcontroller from Onsemi. With a reputation for superior quality and reliability, Onsemi delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this microcontroller offers unmatched value with its advanced features and versatile capabilities. Whether you're a hobbyist or a professional, the LC88F40F0PAU is sure to exceed your expectations and bring your ideas to life. Experience innovation at its best with Onsemi's LC88F40F0PAU microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in the power source while ensuring safe operation within specified limits.

No. of Terminals: 100

Provides a sufficient number of terminals for connecting various peripherals and components.

ROM Words: 393216

Large ROM capacity allows for storing a significant amount of program data and instructions.

Terminal Position: QUAD

Quad terminal position makes it easier to connect and interface with other components in a compact layout.

Speed: 2 rpm

Operates at a speed of 2 rotations per minute, suitable for controlling various devices and applications.

Technical Specifications

Microcontrollers LC88F40F0PAU attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

2 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

No. of I/O Lines:

86

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.67X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

3 mm

Speed:

2 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LC88F40F0PAU Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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