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LC88FC2F0BUTJ-2H

Onsemi

LC88FC2F0BUTJ-2H by Onsemi

LC88FC2F0BUTJ-2H by Onsemi is a 16-bit microcontroller with 393216 ROM words, 24576 RAM bytes, and 16-Ch 12-Bit ADC channels. Ideal for industrial applications requiring a max clock frequency of 24 MHz, it offers various peripherals like POR, PWM(2), RTC, TIMER(9), WDT for versatile connectivity via I2C(3), SIO(3), UART(3).

Median Price

$6.210

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 685 parts In-Stock

1+ parts

$6.210

100+ parts

$4.330

1k+ parts

$4.090

10k+ parts

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685

$6.210

$4.330

$4.090

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Distributors (In-Stock)

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Digiode

USA . 424 parts In-Stock

1+ parts

$6.508

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424

$6.508

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Vyrian

USA . 4,951 parts In-Stock

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4,951

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Flip Electronics

USA . 1,800 parts In-Stock

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1,800

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Distributors (Availability)

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Ampacity Inc.

Singapore . 747 parts In-Stock

1+ parts

$5.820

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747

$5.820

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Corphita

USA . 1,983 parts In-Stock

1+ parts

$6.165

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1,983

$6.165

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Corohmni

South Africa . 179 parts In-Stock

1+ parts

$6.850

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179

$6.850

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Microchip USA

USA . 1,410 parts In-Stock

1+ parts

$19.180

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1,410

$19.180

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Problanco Electronics

Mexico . 7,956 parts In-Stock

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7,956

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SupplyDigital Components

Austria . 7,811 parts In-Stock

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7,811

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TANS Electronics

Latvia . 6,436 parts In-Stock

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6,436

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kulean Microsystems

USA . 2,150 parts In-Stock

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2,150

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UHIMA Technologies

Türkiye . 144 parts In-Stock

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144

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Overview

Unlock endless possibilities with the LC88FC2F0BUTJ-2H microcontroller by Onsemi. This powerful device offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. Whether you're designing IoT devices, smart appliances, or industrial automation systems, this microcontroller delivers exceptional performance and efficiency. Experience seamless connectivity, advanced peripherals, and robust programming capabilities that will take your projects to the next level. Trust in Onsemi's expertise and choose the LC88FC2F0BUTJ-2H for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, suitable for portable and rugged applications.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input range, providing flexibility in power supply options.

Bit Size: 16

16-bit architecture allows for increased processing capability and precision in computations.

ADC Channels: YES

Built-in Analog to Digital Converters enable the microcontroller to interface with sensors and other analog devices.

ROM Words: 393216

Large ROM capacity allows for storing a significant amount of program data and instructions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals and functions in a single chip, reducing external components and simplifying the design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple ADC channels with 12-bit resolution provide accurate analog signal conversion for precise measurements and control.

Connectivity: I2C(3), SIO(3), UART(3)

Support for multiple communication interfaces enables seamless integration with external devices and systems.

Technical Specifications

Microcontrollers LC88FC2F0BUTJ-2H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7 TO 3.6V @ 10 MHZ; ALSO OPERATES ADC WITH 16-CH 8-BIT

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

24576

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

12 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), SIO(3), UART(3)

Peripherals:

POR, PWM(2), RTC, TIMER(9), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

LC88FC2F0BUTJ-2H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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