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LC87FBH08AU-EB-3H

Onsemi

LC87FBH08AU-EB-3H by Onsemi

LC87FBH08AU-EB-3H by Onsemi is an 8-bit microcontroller with 8192 ROM words, 256 RAM bytes, and a max clock frequency of 12 MHz. It is ideal for industrial applications requiring a microcontroller with PWM channels, ADC channels, and 24 I/O lines.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,029 parts In-Stock

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Digiode

USA . 2,408 parts In-Stock

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AZTECH Wire

Italy . 408 parts In-Stock

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$19.530

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$60.132

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$54.720

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$49.308

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$60.132

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Component Stockers USA

USA . 766 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 6,058 parts In-Stock

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TANS Electronics

Latvia . 2,517 parts In-Stock

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Microchip USA

USA . 2,473 parts In-Stock

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Problanco Electronics

Mexico . 2,399 parts In-Stock

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Corphita

USA . 2,160 parts In-Stock

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Kulean Microsystems

USA . 1,719 parts In-Stock

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UHIMA Technologies

Türkiye . 643 parts In-Stock

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Corohmni

South Africa . 393 parts In-Stock

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Overview

Enhance your electronic projects with the LC87FBH08AU-EB-3H microcontroller by Onsemi. Crafted with precision and reliability in mind, this versatile device offers a wide range of applications in the tech industry. With its advanced features and high-quality design, customers can expect seamless performance and innovative solutions for their projects. Don't settle for less when you can have the best - choose the LC87FBH08AU-EB-3H microcontroller for unparalleled value and efficiency in all your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy and efficient integration onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Supports a wide range of power supply options, ensuring compatibility with different systems.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB layout.

Bit Size: 8

An 8-bit microcontroller offers sufficient processing power for many applications while keeping costs low.

Power Supplies (V): 2/5

Multiple power supply options allow for flexibility in system design and energy efficiency.

No. of Terminals: 36

Sufficient number of terminals for interfacing with various external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack style enhances thermal performance and allows for easy heat dissipation.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage enables operation in power-constrained environments.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for reliable performance in demanding conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operation in extreme cold environments.

Terminal Finish: TIN BISMUTH

Tin bismuth finish provides good solderability and corrosion resistance for long-term reliability.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position allows for stable and secure connection on the PCB.

ROM Words: 8192

Ample ROM capacity for program storage and flexibility in firmware development.

Width: 7 mm

Compact width enables space-efficient placement on the PCB.

Maximum Clock Frequency: 12 MHz

High clock frequency supports fast and efficient processing of instructions and data.

Length: 7 mm

Short length contributes to space-saving design and efficient use of PCB real estate.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh operating environments.

Peripheral IC Type: MICROCONTROLLER

Integrated microcontroller peripheral ICs provide a comprehensive set of features for system control and communication.

RAM Bytes: 256

Sufficient RAM capacity for data storage and manipulation in various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and robust mechanical connections on the PCB.

Maximum Supply Current: 10 mA

Low supply current requirements result in energy-efficient operation and extended battery life in portable devices.

PWM Channels: YES

Pulse-width modulation channels enable precise control of power outputs and motor speed in various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick firmware updates and customization.

Terminal Pitch: 0.65 mm

Fine terminal pitch enables high-density mounting and compact PCB design.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates the microcontroller's robustness against moisture during storage and assembly processes.

Speed: 12 rpm

High speed capability supports fast data processing and system response time.

No. of I/O Lines: 24

Sufficient number of I/O lines for interfacing with external devices and peripherals in various applications.

Technical Specifications

Microcontrollers LC87FBH08AU-EB-3H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G36

JESD-609 Code:

e6

Length:

7 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

24

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP36,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LC87FBH08AU-EB-3H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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