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LC87F7DC8AU-TQFP-H

Onsemi

LC87F7DC8AU-TQFP-H by Onsemi

The Onsemi LC87F7DC8AU-TQFP-H microcontroller features 8-bit size, 131072 ROM words, and 4096 RAM bytes. Ideal for industrial applications with a temperature range of -40 to 85 °C, it offers a max supply current of 20mA and operates at speeds up to 12rpm.

Median Price

$4.335

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$3.740

1k+ parts

$3.350

10k+ parts

$3.150

90

-

$3.740

$3.350

$3.150

DigiKey

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$4.930

1k+ parts

-

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90

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$4.930

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Distributors (In-Stock)

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Digiode

USA . 1,066 parts In-Stock

1+ parts

$3.962

100+ parts

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1,066

$3.962

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Vyrian

USA . 6,398 parts In-Stock

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DigiKey Marketplace

USA . 90 parts In-Stock

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90

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Distributors (Availability)

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Corphita

USA . 1,397 parts In-Stock

1+ parts

$3.753

100+ parts

-

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1,397

$3.753

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Corohmni

South Africa . 314 parts In-Stock

1+ parts

$4.170

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314

$4.170

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$49.908

100+ parts

$45.416

1k+ parts

$40.925

10k+ parts

-

500

$49.908

$45.416

$40.925

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SupplyDigital Components

Austria . 5,203 parts In-Stock

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Problanco Electronics

Mexico . 3,871 parts In-Stock

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Kulean Microsystems

USA . 2,219 parts In-Stock

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TANS Electronics

Latvia . 1,496 parts In-Stock

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UHIMA Technologies

Türkiye . 977 parts In-Stock

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977

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Overview

Unleash the power of innovation with the LC87F7DC8AU-TQFP-H microcontroller by Onsemi. Designed for industrial-grade applications, this 8-bit device boasts a robust package body material, advanced CMOS technology, and versatile surface mount capabilities. With a generous ROM of 131072 words and RAM of 4096 bytes, this microcontroller delivers unparalleled performance and reliability. Whether you're designing smart appliances, automotive systems, or IoT devices, the LC87F7DC8AU-TQFP-H offers the perfect balance of quality, efficiency, and value for all your project needs. Elevate your creations to new heights with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging provides good protection for the microcontroller, making it durable and resistant to environmental factors.

Surface Mount: YES

Surface mount capability allows for easy mounting on circuit boards, saving space and simplifying the assembly process.

Bit Size: 8

8-bit processing capability provides a good balance between performance and cost, suitable for a wide range of applications.

Power Supplies (V): 3.3/5

Support for multiple power supply options (3.3V and 5V) offers flexibility in design and compatibility with different systems.

No. of Terminals: 100

Having 100 terminals allows for increased connectivity and integration with other components in a system.

ROM Words: 131072

Large ROM capacity of 131072 words allows for storing a significant amount of program data, enabling complex applications to be implemented.

RAM Bytes: 4096

With 4096 bytes of RAM, the microcontroller can efficiently process and store data during operation, improving overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Maximum Supply Current: 20 mA

Low maximum supply current of 20 mA helps in reducing power consumption and heat dissipation, contributing to the overall efficiency of the system.

ROM Programmability: FLASH

Flash ROM allows for easy and quick programming of the microcontroller, enabling fast prototyping and firmware updates in the field.

Technical Specifications

Microcontrollers LC87F7DC8AU-TQFP-H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC87F7DC8AU-TQFP-H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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