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LC87F5NC8AVU-QIP-E

Onsemi

LC87F5NC8AVU-QIP-E by Onsemi

LC87F5NC8AVU-QIP-E by Onsemi is an 8-bit microcontroller with 131072 ROM words, 4096 RAM bytes, and a max clock frequency of 12 MHz. Ideal for industrial applications requiring a microcontroller with PWM channels, ADC channels, and 81 I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,779 parts In-Stock

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Digiode

USA . 1,225 parts In-Stock

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1,225

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

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AZTECH Wire

Italy . 238 parts In-Stock

1+ parts

$14.480

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238

$14.480

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SupplyDigital Components

Austria . 5,955 parts In-Stock

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5,955

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Kepictronics

USA . 3,655 parts In-Stock

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3,655

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TANS Electronics

Latvia . 3,237 parts In-Stock

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3,237

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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S.R.D Solutions

India . 3,000 parts In-Stock

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Kulean Microsystems

USA . 2,645 parts In-Stock

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Corphita

USA . 2,255 parts In-Stock

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Problanco Electronics

Mexico . 1,867 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Microchip USA

USA . 969 parts In-Stock

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UHIMA Technologies

Türkiye . 218 parts In-Stock

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Corohmni

South Africa . 193 parts In-Stock

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Overview

Discover the LC87F5NC8AVU-QIP-E by Onsemi, a top-quality microcontroller that offers unparalleled performance and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, you can trust that this product is built to last. Ideal for a wide range of applications, from industrial automation to consumer electronics, this microcontroller provides value and benefits that will take your projects to the next level. Experience the advantages of seamless integration, efficient power management, and advanced features designed to meet your specific needs. Choose the LC87F5NC8AVU-QIP-E for superior performance and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in the power source, accommodating a wide range of applications.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration with other components on the circuit board, optimizing space utilization.

Bit Size: 8

An 8-bit microcontroller is suitable for applications that require processing smaller chunks of data efficiently.

Power Supplies (V): 2.5/5

The dual power supply options provide compatibility with different voltage requirements, making the microcontroller versatile.

No. of Terminals: 100

With a high number of terminals, this microcontroller can interface with a variety of external devices and peripherals, enhancing its functionality.

Package Style (Meter): FLATPACK

Flatpack style simplifies the manufacturing process and allows for easy installation in tight spaces.

Minimum Supply Voltage: 2.8 V

The low minimum supply voltage ensures efficient power consumption and extends the operating range of the microcontroller.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the microcontroller suitable for industrial environments where elevated temperatures may be present.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microcontroller can function reliably in cold environments without risk of damage.

Terminal Finish: TIN BISMUTH

Tin bismuth finish provides excellent solderability and corrosion resistance, ensuring a reliable connection between the microcontroller and the PCB.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors, enabling precise data acquisition and processing.

Terminal Position: QUAD

Quad terminal position facilitates efficient soldering and enhances the stability of the connections, improving the overall reliability of the product.

ROM Words: 131072

The large ROM size allows for storing a significant amount of program data, enabling complex algorithms and applications to run smoothly on the microcontroller.

Width: 14 mm

Compact width dimension makes the microcontroller suitable for space-constrained designs, while still offering a high level of functionality.

Maximum Clock Frequency: 12 MHz

High maximum clock frequency enables fast processing speeds, making the microcontroller ideal for applications that require real-time data processing.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature ensures efficient soldering during manufacturing processes, reducing the risk of thermal damage to the microcontroller.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance indicates the robustness of the microcontroller during soldering processes, ensuring reliability in manufacturing.

Length: 20 mm

The compact length dimension enables easy integration of the microcontroller into various electronic devices, optimizing space usage on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the microcontroller can withstand harsh environmental conditions typically found in industrial applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals on a single chip, making it a cost-effective and efficient solution for embedded systems.

RAM Bytes: 4096

A generous amount of RAM allows for efficient data storage and processing, enabling the microcontroller to handle complex tasks and multitasking operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and robustness to the connections, enhancing the durability and reliability of the microcontroller in various applications.

Maximum Supply Current: 20.5 mA

The low maximum supply current consumption indicates energy efficiency, making the microcontroller suitable for battery-operated or low-power applications.

PWM Channels: YES

The presence of PWM channels allows the microcontroller to generate precise analog signals, enabling control of motors, lights, and other devices with varying power levels.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and applications, ensuring the microcontroller can adapt to changing requirements.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density mounting on the PCB, saving space and allowing for more features to be integrated into the design.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates the microcontroller can withstand exposure to ambient humidity during storage and assembly processes, ensuring long-term reliability.

Speed: 12 rpm

The rated speed of 12 rpm indicates the microcontroller's ability to process instructions and data efficiently, contributing to overall system performance.

No. of I/O Lines: 81

With a high number of I/O lines, the microcontroller offers ample connectivity options for interfacing with external devices and peripherals, enhancing its versatility in various applications.

Technical Specifications

Microcontrollers LC87F5NC8AVU-QIP-E attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e6

Length:

20 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

81

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LC87F5NC8AVU-QIP-E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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