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LC87F5NC8AU-QIP-E

Onsemi

LC87F5NC8AU-QIP-E by Onsemi

LC87F5NC8AU-QIP-E by Onsemi is an 8-bit microcontroller with 131072 ROM words and 4096 RAM bytes. It operates in industrial temperature range (-40 to 85 °C) and has a max supply current of 20.5 mA. This microcontroller is suitable for applications requiring high memory capacity and reliable performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,651 parts In-Stock

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Digiode

USA . 463 parts In-Stock

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463

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AZTECH Wire

Italy . 1,175 parts In-Stock

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$20.750

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$20.750

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Ampacity Inc.

Singapore . 142 parts In-Stock

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$26.000

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Component Stockers USA

USA . 371 parts In-Stock

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$99.990

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371

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TANS Electronics

Latvia . 5,191 parts In-Stock

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Kulean Microsystems

USA . 4,934 parts In-Stock

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Problanco Electronics

Mexico . 4,344 parts In-Stock

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SupplyDigital Components

Austria . 2,779 parts In-Stock

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UHIMA Technologies

Türkiye . 940 parts In-Stock

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Corohmni

South Africa . 417 parts In-Stock

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Microchip USA

USA . 126 parts In-Stock

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Corphita

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Overview

Upgrade your projects with the LC87F5NC8AU-QIP-E microcontroller by Onsemi, a high-quality and reliable solution for a wide range of applications. With Onsemi's reputation for superior manufacturing standards, you can trust in the performance and durability of this product. Ideal for industrial settings, this microcontroller offers advanced features and capabilities, providing customers with exceptional value and benefits. Experience seamless integration and enhanced functionality with the LC87F5NC8AU-QIP-E, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for various applications and environments.

Surface Mount: YES

Surface mount technology makes the microcontroller easy to integrate onto PCBs, saving space and simplifying the manufacturing process.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost, suitable for a wide range of embedded system applications.

Power Supplies (V): 2.5/5

Support for multiple power supply options (2.5V and 5V) gives flexibility in designing and powering the system.

No. of Terminals: 100

Having 100 terminals allows for a sufficient number of connections to peripherals and external components, increasing the microcontroller's versatility.

Package Style (Meter): FLATPACK

The flatpack design simplifies PCB assembly and improves heat dissipation, making it a practical choice for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the microcontroller can withstand high temperatures and is suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The microcontroller can operate in harsh cold environments down to -40 °C, ensuring reliable performance in various temperature conditions.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth terminal finish provides good solderability and reliability, enhancing the microcontroller's overall performance and longevity.

ROM Words: 131072

Having 131072 ROM words allows for storing a large amount of program data, enabling complex applications to run on the microcontroller.

RAM Bytes: 4096

4096 bytes of RAM provide sufficient memory for storing and processing data during operation, meeting the requirements of most embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and inspection processes, improving the overall manufacturability of the product.

Maximum Supply Current: 20.5 mA

With a maximum supply current of 20.5 mA, the microcontroller consumes low power, making it ideal for battery-powered applications or energy-efficient designs.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and reprogramming of the microcontroller's firmware, providing flexibility in the development process.

Terminal Pitch: 0.635 mm

Having a terminal pitch of 0.635 mm simplifies PCB layout and assembly, allowing for higher component density and smaller form factor designs.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the microcontroller is suitable for reflow soldering processes and can withstand moderate levels of moisture exposure during manufacturing.

Technical Specifications

Microcontrollers LC87F5NC8AU-QIP-E attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Sub-Category:

Microcontrollers

Maximum Supply Current:

20.5 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

LC87F5NC8AU-QIP-E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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