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LC87F5N62BU-QIP-E

Onsemi

LC87F5N62BU-QIP-E by Onsemi

LC87F5N62BU-QIP-E by Onsemi is an 8-bit microcontroller with 67584 ROM words and 2048 RAM bytes. It operates at temperatures ranging from -40 to 85°C, making it suitable for industrial applications. With a max supply current of 20.5 mA, this CMOS technology-based microcontroller is ideal for various electronic devices requiring low power consumption.

Median Price

$3.230

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$3.230

1k+ parts

$2.890

10k+ parts

$2.720

50

-

$3.230

$2.890

$2.720

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,920 parts In-Stock

1+ parts

$3.420

100+ parts

-

1k+ parts

-

10k+ parts

-

1,920

$3.420

-

-

-

Vyrian

USA . 7,776 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,776

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,083 parts In-Stock

1+ parts

$3.240

100+ parts

-

1k+ parts

-

10k+ parts

-

1,083

$3.240

-

-

-

Corohmni

South Africa . 444 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

-

444

$3.600

-

-

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AZTECH Wire

Italy . 62 parts In-Stock

1+ parts

$13.750

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$13.750

-

-

-

Microchip USA

USA . 188 parts In-Stock

1+ parts

$25.790

100+ parts

$25.630

1k+ parts

$25.560

10k+ parts

$25.480

188

$25.790

$25.630

$25.560

$25.480

TANS Electronics

Latvia . 8,005 parts In-Stock

1+ parts

-

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8,005

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Problanco Electronics

Mexico . 7,596 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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7,596

-

-

-

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SupplyDigital Components

Austria . 6,713 parts In-Stock

1+ parts

-

100+ parts

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6,713

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UHIMA Technologies

Türkiye . 745 parts In-Stock

1+ parts

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745

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Kulean Microsystems

USA . 623 parts In-Stock

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100+ parts

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623

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Overview

Unleash the power of innovation with the LC87F5N62BU-QIP-E by Onsemi. As a leading manufacturer in the microcontroller industry, Onsemi delivers top-quality products that exceed expectations. This versatile microcontroller is perfect for a wide range of applications, offering unparalleled value and performance. Experience seamless functionality and reliable operation with the LC87F5N62BU-QIP-E, designed to elevate your projects to new heights. Choose Onsemi for cutting-edge technology and unmatched reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor for ease of design and compatibility.

Bit Size: 8

8-bit size allows for efficient processing of data and suitable for applications that do not require complex computations.

Power Supplies (V): 3/5

Support for multiple power supply voltages gives flexibility in design and compatibility with different power sources.

No. of Terminals: 100

Having 100 terminals provides enough connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK

Flatpack package style offers a compact form factor for space-constrained applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold environments without impacting performance.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth terminal finish provides good solderability and reliability for long-term use.

Terminal Position: QUAD

Quad terminal position offers efficient layout and ease of connection in PCB designs.

ROM Words: 67584

Large ROM capacity allows for storing a significant amount of program data and instructions.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable performance in demanding industrial environments.

RAM Bytes: 2048

Adequate RAM size for temporary data storage and efficient data processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Maximum Supply Current: 20.5 mA

Low maximum supply current consumption for energy-efficient operation.

ROM Programmability: FLASH

Flash ROM programmability allows for easier updating and reprogramming of firmware.

Terminal Pitch: 0.635 mm

Fine terminal pitch enables high-density integration on PCBs and space-efficient designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the device can withstand moderate exposure to moisture during handling and assembly.

Technical Specifications

Microcontrollers LC87F5N62BU-QIP-E attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

67584

ROM Programmability:

FLASH

Sub-Category:

Microcontrollers

Maximum Supply Current:

20.5 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

LC87F5N62BU-QIP-E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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