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LC87F2J32AU-QIP-E

Onsemi

LC87F2J32AU-QIP-E by Onsemi

LC87F2J32AU-QIP-E by Onsemi is an 8-bit microcontroller with 48 terminals, operating at a max frequency of 12 MHz. It features 14-channel ADCs, UART connectivity, and Flash ROM programmability. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

$2.212

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,110 parts In-Stock

1+ parts

-

100+ parts

$1.980

1k+ parts

$1.770

10k+ parts

$1.660

6,110

-

$1.980

$1.770

$1.660

Farnell

UK . 6,110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.650

10k+ parts

-

6,110

-

-

$2.650

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Verical

USA . 5,460 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.212

10k+ parts

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5,460

-

-

$2.212

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Distributors (In-Stock)

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Digiode

USA . 483 parts In-Stock

1+ parts

$2.080

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-

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483

$2.080

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Vyrian

USA . 5,588 parts In-Stock

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5,588

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Bristol Electronics

USA . 290 parts In-Stock

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290

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Dan-Mar Components

USA . 290 parts In-Stock

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290

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Distributors (Availability)

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Corphita

USA . 1,747 parts In-Stock

1+ parts

$1.971

100+ parts

-

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1,747

$1.971

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Corohmni

South Africa . 249 parts In-Stock

1+ parts

$2.190

100+ parts

-

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249

$2.190

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AZTECH Wire

Italy . 279 parts In-Stock

1+ parts

$13.090

100+ parts

-

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279

$13.090

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QUARKTWIN TECHNOLOGY LTD

USA . 20,949 parts In-Stock

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20,949

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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SupplyDigital Components

Austria . 6,229 parts In-Stock

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6,229

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Continental Prestige Electronics

USA . 6,110 parts In-Stock

1+ parts

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100+ parts

$2.650

1k+ parts

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6,110

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$2.650

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A-Z Elektronik GmbH

Germany . 5,801 parts In-Stock

1+ parts

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5,801

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Problanco Electronics

Mexico . 4,854 parts In-Stock

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4,854

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Alle Elektronik GmbH

Germany . 3,867 parts In-Stock

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3,867

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TANS Electronics

Latvia . 3,643 parts In-Stock

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3,643

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Microchip USA

USA . 421 parts In-Stock

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421

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Kulean Microsystems

USA . 392 parts In-Stock

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392

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UHIMA Technologies

Türkiye . 274 parts In-Stock

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274

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Kepictronics

USA . 206 parts In-Stock

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206

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Overview

Unlock the potential of your next project with the LC87F2J32AU-QIP-E microcontroller by Onsemi. Renowned for its high quality and reliability, Onsemi brings you a versatile solution for a wide range of applications. With advanced features and capabilities, this microcontroller offers unmatched value, providing customers with enhanced performance and efficiency. From industrial automation to consumer electronics, this product delivers superior functionality and ease of use, making it the ideal choice for all your design needs. Elevate your projects with the LC87F2J32AU-QIP-E and experience innovation at its best.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and reducing complexity.

Maximum Supply Voltage: 5.5 V

Can operate with a wide range of supply voltages, making it versatile and compatible with different power sources.

On Chip Data RAM Width: 8

Provides sufficient memory space for storing and processing data efficiently.

Package Shape: SQUARE

Sleek and compact design making it easier to handle and install in tight spaces.

Bit Size: 8

Suitable for handling and processing data in small sizes, ideal for microcontroller applications.

ADC Channels: YES

Supports analog-to-digital conversion, allowing for interfacing with analog sensors and signals.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, ensuring optimal performance and functionality.

Maximum Clock Frequency: 12 MHz

Provides high processing speed for handling complex tasks and operations efficiently.

ROM Programmability: FLASH

Allows for easy and convenient reprogramming of the memory, enabling flexibility in application development.

Connectivity: UART

Includes UART connectivity for easy interfacing with other devices, enhancing communication capabilities.

Technical Specifications

Microcontrollers LC87F2J32AU-QIP-E attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQFP-G48

JESD-609 Code:

e6

Length:

14 mm

Moisture Sensitivity Level (MSL):

4

No. of External Interrupts:

6

No. of I/O Lines:

39

No. of Terminals:

48

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

QFP

Package Equivalence Code:

QFP48,.65SQ,40

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

3 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.7 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

UART

Peripherals:

POR, PWM(2), TIMER(6), WDT

Analog To Digital Convertors:

14-Ch 12-Bit

Trade Compliance

LC87F2J32AU-QIP-E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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