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LC87F2G08AU-SSOP-E

Onsemi

LC87F2G08AU-SSOP-E by Onsemi

LC87F2G08AU-SSOP-E by Onsemi is an 8-bit microcontroller with 24 terminals, operating at a voltage range of 3V to 5.5V. It features 256 bytes of RAM, 8192 ROM words, and PWM channels for industrial applications requiring high-speed processing and ADC capabilities.

Median Price

$2.529

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 278 parts In-Stock

1+ parts

$3.270

100+ parts

$2.400

1k+ parts

$1.720

10k+ parts

$1.520

278

$3.270

$2.400

$1.720

$1.520

Farnell

UK . 2,800 parts In-Stock

1+ parts

$3.394

100+ parts

$3.125

1k+ parts

$2.920

10k+ parts

-

2,800

$3.394

$3.125

$2.920

-

Rochester

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

$1.600

1k+ parts

$1.430

10k+ parts

$1.340

2,800

-

$1.600

$1.430

$1.340

Verical

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.788

10k+ parts

$1.675

2,800

-

-

$1.788

$1.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,448 parts In-Stock

1+ parts

$1.691

100+ parts

-

1k+ parts

-

10k+ parts

-

1,448

$1.691

-

-

-

Vyrian

USA . 8,569 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,569

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,858 parts In-Stock

1+ parts

$1.602

100+ parts

-

1k+ parts

-

10k+ parts

-

1,858

$1.602

-

-

-

Corohmni

South Africa . 383 parts In-Stock

1+ parts

$1.780

100+ parts

-

1k+ parts

-

10k+ parts

-

383

$1.780

-

-

-

Continental Prestige Electronics

USA . 2,800 parts In-Stock

1+ parts

$2.650

100+ parts

$2.440

1k+ parts

$2.280

10k+ parts

-

2,800

$2.650

$2.440

$2.280

-

Problanco Electronics

Mexico . 8,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,248

-

-

-

-

SupplyDigital Components

Austria . 5,935 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,935

-

-

-

-

Kulean Microsystems

USA . 5,584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,584

-

-

-

-

TANS Electronics

Latvia . 4,909 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,909

-

-

-

-

Kepictronics

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,800

-

-

-

-

Microchip USA

USA . 325 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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325

-

-

-

-

UHIMA Technologies

Türkiye . 124 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

124

-

-

-

-

Overview

Upgrade your electronic devices with the LC87F2G08AU-SSOP-E microcontroller by Onsemi. Known for its high-quality products, Onsemi delivers reliable solutions for a wide range of applications. This powerful 8-bit microcontroller offers customers value and benefits such as efficient performance, versatile functionality, and easy integration. Whether you're working on robotics, automotive systems, or consumer electronics, the LC87F2G08AU-SSOP-E is the perfect choice for your next project. Experience the advantages of this top-of-the-line microcontroller and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit designs.

Bit Size: 8

Provides sufficient computational power for a wide range of applications.

Power Supplies (V): 2/5

Supports multiple power supply options for versatility in design.

No. of Terminals: 24

Offers ample connectivity for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package size saves space on the circuit board.

Minimum Supply Voltage: 3 V

Can operate at low voltage levels, conserving power.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature ranges.

Minimum Operating Temperature: -40 °C

Can withstand cold temperatures, making it suitable for diverse operating conditions.

Terminal Finish: TIN BISMUTH

Helps prevent corrosion and ensures reliable contact with other components.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling measurement of external signals.

Terminal Position: DUAL

Offers flexibility in mounting and connectivity options.

ROM Words: 8192

Sufficient memory capacity for storing program instructions and data.

Width: 6 mm

Compact width for space-saving on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly process.

Peak Reflow Temperature °C: 260

Withstands high temperatures during reflow soldering process.

Length: 13 mm

Optimal length for easy placement on the circuit board.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements for reliable operation.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications, ensuring efficient performance.

RAM Bytes: 256

Adequate random-access memory for storing transient data during operation.

Technology: CMOS

Low power consumption technology for energy-efficient operation.

Terminal Form: GULL WING

Facilitates easy soldering onto the circuit board.

Maximum Supply Current: 16.2 mA

Efficient power usage and low current draw for extended battery life.

PWM Channels: YES

Supports pulse-width modulation for precise control of output signals.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller.

Terminal Pitch: 1 mm

Standard terminal pitch for compatibility with common circuit board designs.

Moisture Sensitivity Level (MSL): 4

Designed to withstand moderate moisture exposure during handling and operation.

Speed: 24.4 rpm

Provides fast processing speeds for quick response in real-time applications.

No. of I/O Lines: 19

Sufficient input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LC87F2G08AU-SSOP-E attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Length:

13 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

19

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

24.4 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

16.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Trade Compliance

LC87F2G08AU-SSOP-E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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