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LC87F1L16AUWA-2H

Onsemi

LC87F1L16AUWA-2H by Onsemi

LC87F1L16AUWA-2H by Onsemi is an 8-bit microcontroller with 16384 ROM words and 2048 RAM bytes. It operates at a speed of 12 rpm, has 34 I/O lines, and supports PWM channels. This industrial-grade device is ideal for applications requiring precise control and data processing in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 69,000 parts In-Stock

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Vyrian

USA . 11,417 parts In-Stock

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Digiode

USA . 1,890 parts In-Stock

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AZTECH Wire

Italy . 612 parts In-Stock

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$18.330

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Component Stockers USA

USA . 582 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 7,457 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 3,379 parts In-Stock

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Microchip USA

USA . 2,494 parts In-Stock

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TANS Electronics

Latvia . 2,410 parts In-Stock

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Kulean Microsystems

USA . 1,266 parts In-Stock

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UHIMA Technologies

Türkiye . 962 parts In-Stock

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Corphita

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South Africa . 310 parts In-Stock

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Overview

Unleash the power of innovation with the LC87F1L16AUWA-2H microcontroller by Onsemi. Designed with precision and quality in mind, this product offers unmatched performance for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value and benefits to customers seeking reliability and efficiency. Trust in Onsemi's expertise and experience in microcontrollers, and elevate your projects to new heights with the LC87F1L16AUWA-2H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the microcontroller from external elements, ensuring a long lifespan.

Surface Mount: YES

Easy to install and saves space on the circuit board, making it suitable for compact designs.

Maximum Supply Voltage: 5.5 V

Supports a wide range of power inputs, making it versatile for different applications.

Bit Size: 8

Offers good processing power and efficiency for various tasks.

Power Supplies (V): 3/5

Compatibility with different power supplies for flexibility in usage.

No. of Terminals: 48

Sufficient number of terminals for connecting to external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact and low-profile design for space-constrained applications.

Minimum Supply Voltage: 3 V

Works efficiently with low power supply, ideal for battery-powered devices.

ADC Channels: YES

Ability to convert analog signals to digital data for precise measurements and sensor integration.

Terminal Position: QUAD

Quad terminal position ensures stable connections and ease of soldering.

ROM Words: 16384

Sufficient memory for storing program instructions and data.

Width: 7 mm

Compact width for fitting into small enclosures or tight spaces.

Length: 7 mm

Compact length for space-efficient designs.

Temperature Grade: INDUSTRIAL

Can withstand a wide range of temperatures, making it suitable for industrial environments.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for controlling various functions in electronic devices.

RAM Bytes: 2048

Sufficient random-access memory for storing temporary data during operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and robust connections.

Maximum Supply Current: 25 mA

Low power consumption to extend battery life in portable devices.

PWM Channels: YES

Ability to generate PWM signals for controlling motors, LEDs, and other devices.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller without removing it from the circuit.

Terminal Pitch: 0.5 mm

Fine pitch terminals for compact layout and efficient signal routing.

Speed: 12 rpm

Operates at a speed of 12 revolutions per minute for timely processing and response.

No. of I/O Lines: 34

Offers a sufficient number of input/output lines for connecting to external devices and sensors.

Technical Specifications

Microcontrollers LC87F1L16AUWA-2H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

34

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LC87F1L16AUWA-2H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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