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LC87F0A08AU-EB-TLM-H

Onsemi

LC87F0A08AU-EB-TLM-H by Onsemi

LC87F0A08AU-EB-TLM-H by Onsemi is an 8-bit microcontroller with 8192 ROM words, 256 RAM bytes, and 8-Ch 12-Bit ADC channels. Ideal for industrial applications, it features TIMER(4), WDT peripherals, and a max clock frequency of 12 MHz. With a package style of FLATPACK and low profile design, this microcontroller operates in temperatures ranging from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,942 parts In-Stock

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Digiode

USA . 347 parts In-Stock

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347

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AZTECH Wire

Italy . 731 parts In-Stock

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$16.910

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731

$16.910

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SupplyDigital Components

Austria . 7,874 parts In-Stock

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Kulean Microsystems

USA . 6,815 parts In-Stock

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TANS Electronics

Latvia . 2,810 parts In-Stock

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Corphita

USA . 1,384 parts In-Stock

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Microchip USA

USA . 1,192 parts In-Stock

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Problanco Electronics

Mexico . 1,005 parts In-Stock

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UHIMA Technologies

Türkiye . 907 parts In-Stock

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Corohmni

South Africa . 150 parts In-Stock

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Overview

Unlock the potential of your electronic projects with Onsemi's LC87F0A08AU-EB-TLM-H microcontroller. Designed with precision and reliability in mind, this versatile device offers customers a range of applications from robotics to smart home systems. With its advanced technology and high-quality construction, this microcontroller provides value and benefits that exceed expectations. Experience seamless connectivity, powerful peripherals, and efficient performance with Onsemi's cutting-edge product. Elevate your projects to new heights with the LC87F0A08AU-EB-TLM-H microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the microcontroller.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, making installation smoother and faster.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, providing flexibility in power source options.

Bit Size: 8

The 8-bit size allows for efficient processing and control capabilities.

ADC Channels: YES

Integrated ADC channels enable analog to digital conversion, expanding the range of input signals that can be processed.

ROM Words: 8192

Large ROM capacity allows for storing a considerable amount of program data.

RAM Bytes: 256

Adequate RAM size for temporary data storage, enhancing processing speed and performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall efficiency.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple ADC channels with 12-bit resolution provide accurate and detailed conversion of analog signals.

Connectivity: SIO

SIO connectivity enables communication with various external devices, enhancing versatility and functionality.

Technical Specifications

Microcontrollers LC87F0A08AU-EB-TLM-H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO 8-CH 8-BIT ADC SUPPORTS

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G36

JESD-609 Code:

e6

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

36

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SIO

Peripherals:

TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

LC87F0A08AU-EB-TLM-H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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