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LC823450TA-2H

Onsemi

LC823450TA-2H by Onsemi

LC823450TA-2H by Onsemi is a consumer IC with 128 terminals in a flatpack, thin profile package. Operating temperature ranges from -20 to 65 °C, suitable for commercial applications. With matte tin terminal finish and quad position, it has a min supply voltage of 0.93V and max of 1.27V.

Median Price

$19.300

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 618 parts In-Stock

1+ parts

$19.300

100+ parts

$13.170

1k+ parts

$11.710

10k+ parts

-

618

$19.300

$13.170

$11.710

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,324 parts In-Stock

1+ parts

$17.119

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2,324

$17.119

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Vyrian

USA . 3,053 parts In-Stock

1+ parts

-

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3,053

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Flip Electronics

USA . 1,800 parts In-Stock

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1,800

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Chip Stock

USA . 375 parts In-Stock

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375

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$2.398

100+ parts

$2.182

1k+ parts

$1.966

10k+ parts

-

2,500

$2.398

$2.182

$1.966

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Corphita

USA . 1,727 parts In-Stock

1+ parts

$16.218

100+ parts

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1,727

$16.218

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Corohmni

South Africa . 380 parts In-Stock

1+ parts

$16.970

100+ parts

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380

$16.970

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QUARKTWIN TECHNOLOGY LTD

USA . 23,904 parts In-Stock

1+ parts

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23,904

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Microchip USA

USA . 10,072 parts In-Stock

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10,072

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Problanco Electronics

Mexico . 6,224 parts In-Stock

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6,224

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TANS Electronics

Latvia . 5,900 parts In-Stock

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5,900

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Kulean Microsystems

USA . 4,227 parts In-Stock

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4,227

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Perfect Parts

USA . 3,718 parts In-Stock

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3,718

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SupplyDigital Components

Austria . 3,423 parts In-Stock

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3,423

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UHIMA Technologies

Türkiye . 808 parts In-Stock

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808

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Authorized Procurement Solutions

USA . 410 parts In-Stock

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410

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Overview

Enhance your electronic devices with the cutting-edge technology of the LC823450TA-2H by Onsemi. Manufactured by a trusted industry leader, this consumer IC offers unparalleled quality and reliability. Ideal for a variety of applications, this product delivers superior performance and efficiency. Experience the value and benefits this innovative component brings to your projects, providing you with a competitive edge in the market. Upgrade your designs with the LC823450TA-2H and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and labor costs.

Package Shape: SQUARE

Square package shape provides a compact and space-saving design for the IC.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer circuit applications, ensuring reliable performance in consumer electronics.

No. of Terminals: 128

128 terminals offer a wide range of connectivity options, making it versatile for different circuit configurations.

Terminal Finish: MATTE TIN

Matte Tin terminal finish provides good conductivity and solderability for secure connections.

Maximum Operating Temperature: 65 °C

With a high maximum operating temperature, this IC can withstand elevated temperatures without performance degradation.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows for reliable performance in cold environments.

Terminal Position: QUAD

Quad terminal position offers stable mounting and good thermal dissipation for the IC.

Width: 14 mm

Compact width size makes it suitable for space-constrained applications.

Maximum Supply Voltage (Vsup): 1.27 V

With a maximum supply voltage of 1.27 V, this IC is suitable for low power consumption applications.

Technical Specifications

Other Function Consumer ICs LC823450TA-2H attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

128

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP128,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

1.27 V

Minimum Supply Voltage (Vsup):

.93 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

LC823450TA-2H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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