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LC823450RAH-XX

Onsemi

LC823450RAH-XX by Onsemi

LC823450RAH-XX by Onsemi is a consumer circuit IC with 240 terminals, operating temperature range of -20 to 65 °C. It has a supply voltage range from 1.1V to 1.27V and comes in a surface-mount plastic/epoxy package. Ideal for various consumer electronic applications requiring high terminal count and precise voltage regulation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,820 parts In-Stock

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1,820

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Vyrian

USA . 878 parts In-Stock

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878

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 4,856 parts In-Stock

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4,856

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TANS Electronics

Latvia . 4,208 parts In-Stock

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4,208

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SupplyDigital Components

Austria . 3,516 parts In-Stock

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3,516

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Corphita

USA . 991 parts In-Stock

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991

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Problanco Electronics

Mexico . 570 parts In-Stock

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570

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Corohmni

South Africa . 484 parts In-Stock

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484

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UHIMA Technologies

Türkiye . 436 parts In-Stock

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436

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Overview

Discover the cutting-edge LC823450RAH-XX by Onsemi, a top-tier manufacturer known for its superior quality and innovation in the field of consumer ICs. This versatile product offers a multitude of applications, ensuring optimal performance in various electronic devices. With its advanced features and reliable design, customers can expect unmatched value, benefits, and advantages. Upgrade your technology with the LC823450RAH-XX and experience the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight, durable, and cost-effective, making the product easy to handle and cost-efficient.

Surface Mount: YES

Surface mount technology allows for more compact design, higher component density, and improved reliability in the product.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, this product is suitable for a wide range of consumer electronic devices, ensuring versatility and compatibility.

No. of Terminals: 240

With a large number of terminals, this product can accommodate multiple connections and functions, providing flexibility and customization options.

Maximum Operating Temperature: 65 °C

The high maximum operating temperature ensures the reliability and stability of the product even under demanding environmental conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows the product to function efficiently in cold environments, increasing its usability and durability.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation and connection process, making it more convenient for users to integrate the product into their designs.

Minimum Supply Voltage (Vsup): 1.1 V

Low minimum supply voltage requirement ensures energy efficiency and compatibility with a variety of power sources, making the product more versatile and energy-efficient.

Terminal Form: BALL

Ball terminals offer secure connections and efficient heat dissipation, enhancing the product's performance and reliability.

Maximum Supply Voltage (Vsup): 1.27 V

The maximum supply voltage ensures safe operation and protection against overvoltage, making the product reliable and durable under varying voltage conditions.

Technical Specifications

Other Function Consumer ICs LC823450RAH-XX attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

X-PBGA-B240

No. of Terminals:

240

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA240(UNSPEC)

Package Shape:

Maximum Supply Voltage (Vsup):

1.27 V

Minimum Supply Voltage (Vsup):

1.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

LC823450RAH-XX General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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