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LC823430TA

Onsemi

LC823430TA by Onsemi

LC823430TA by Onsemi is a consumer IC with 128 terminals in a square package. It operates b/w -20 °C to 75°C, with supply voltage ranging from 1.15V to 1.65V. This CMOS technology IC is ideal for various consumer circuit applications due to its thin profile and fine pitch design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,799 parts In-Stock

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Digiode

USA . 753 parts In-Stock

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753

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SupplyDigital Components

Austria . 3,034 parts In-Stock

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3,034

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TANS Electronics

Latvia . 2,009 parts In-Stock

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2,009

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Corphita

USA . 979 parts In-Stock

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979

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Kulean Microsystems

USA . 905 parts In-Stock

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UHIMA Technologies

Türkiye . 648 parts In-Stock

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648

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Problanco Electronics

Mexico . 500 parts In-Stock

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500

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Corohmni

South Africa . 348 parts In-Stock

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Overview

Discover the LC823430TA by Onsemi, a cutting-edge consumer IC that offers unparalleled quality and reliability. Manufactured by industry leader Onsemi, this innovative product is designed to exceed expectations in a variety of applications. With a compact square package and advanced technology, this IC provides customers with unmatched value and benefits. Experience superior performance and functionality with the LC823430TA, setting new standards in the world of consumer circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the IC, ensuring reliable performance.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Optimal shape for efficient use of space on PCBs.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, ensuring compatibility and performance.

No. of Terminals: 128

Offers a high level of connectivity for a range of functions and features.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

Enables compact design and high density integration.

Maximum Operating Temperature: 75 °C

Suitable for a variety of operating environments, ensuring stability and reliability.

Minimum Operating Temperature: -20 °C

Wide operating temperature range for versatility in different conditions.

Terminal Position: QUAD

Quad terminal positioning allows for efficient wiring and connectivity.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

Width: 14 mm

Compact width for efficient use of space on PCBs.

Minimum Supply Voltage (Vsup): 1.15 V

Low minimum supply voltage for energy efficiency.

Length: 14 mm

Compact length for space-saving design.

Temperature Grade: COMMERCIAL EXTENDED

Designed for extended commercial use, ensuring durability and reliability.

Technology: CMOS

CMOS technology offers low power consumption and high performance.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and secure connections.

Terminal Pitch: 0.4 mm

Fine terminal pitch for high density interconnects.

Maximum Supply Voltage (Vsup): 1.65 V

Sufficient maximum supply voltage for stable operation.

Technical Specifications

Other Function Consumer ICs LC823430TA attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.7 TO 3.3 V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G128

Length:

14 mm

No. of Functions:

1

No. of Terminals:

128

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

1.65 V

Minimum Supply Voltage (Vsup):

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LC823430TA General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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