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LC823425-12G1-H

Onsemi

LC823425-12G1-H by Onsemi

CONSUMER CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: TFQFP; Package Shape: SQUARE;

Median Price

$10.300

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 12,600 parts In-Stock

1+ parts

-

100+ parts

$9.560

1k+ parts

$9.560

10k+ parts

$9.560

12,600

-

$9.560

$9.560

$9.560

Flip Electronics (Authorized)

USA . 12,600 parts In-Stock

1+ parts

-

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-

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12,600

-

-

-

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Rochester

USA . 5,400 parts In-Stock

1+ parts

-

100+ parts

$10.300

1k+ parts

$9.210

10k+ parts

$8.670

5,400

-

$10.300

$9.210

$8.670

Verical

USA . 3,150 parts In-Stock

1+ parts

-

100+ parts

$12.875

1k+ parts

$11.512

10k+ parts

$10.838

3,150

-

$12.875

$11.512

$10.838

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,453 parts In-Stock

1+ parts

$9.560

100+ parts

-

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-

10k+ parts

-

1,453

$9.560

-

-

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Digiode

USA . 444 parts In-Stock

1+ parts

$10.896

100+ parts

-

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444

$10.896

-

-

-

Flip Electronics

USA . 12,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

12,600

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 500 parts In-Stock

1+ parts

$9.560

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$9.560

-

-

-

Corphita

USA . 512 parts In-Stock

1+ parts

$10.323

100+ parts

-

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-

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512

$10.323

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 25,374 parts In-Stock

1+ parts

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25,374

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-

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TANS Electronics

Latvia . 7,194 parts In-Stock

1+ parts

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7,194

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-

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Continental Prestige Electronics

USA . 5,400 parts In-Stock

1+ parts

-

100+ parts

$10.190

1k+ parts

-

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5,400

-

$10.190

-

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SupplyDigital Components

Austria . 2,270 parts In-Stock

1+ parts

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2,270

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-

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Kulean Microsystems

USA . 1,569 parts In-Stock

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1,569

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-

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Problanco Electronics

Mexico . 537 parts In-Stock

1+ parts

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537

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UHIMA Technologies

Türkiye . 407 parts In-Stock

1+ parts

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407

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Microchip USA

USA . 326 parts In-Stock

1+ parts

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100+ parts

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326

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Kepictronics

USA . 150 parts In-Stock

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150

-

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-

Technical Specifications

Other Function Consumer ICs LC823425-12G1-H attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Additional Features:

ALSO REQUIRES 1.1 TO 1.3 V

General IC Type:

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

128

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP128,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.1 V

Minimum Supply Voltage (Vsup):

.93 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

LC823425-12G1-H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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