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LC823450XATBG

Onsemi

LC823450XATBG by Onsemi

LC823450XATBG by Onsemi is a consumer IC with 154 terminals in a grid array package. It operates b/w -20 °C to 65°C, with supply voltage ranging from 0.93V to 1.27V. This IC is suitable for various consumer circuit applications due to its compact size and fine pitch design.

Median Price

$12.040

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$10.400

1k+ parts

$9.310

10k+ parts

$8.760

1,000

-

$10.400

$9.310

$8.760

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$12.040

1k+ parts

$12.040

10k+ parts

$12.040

1,000

-

$12.040

$12.040

$12.040

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$13.000

1k+ parts

$11.637

10k+ parts

-

1,000

-

$13.000

$11.637

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 692 parts In-Stock

1+ parts

$11.001

100+ parts

-

1k+ parts

-

10k+ parts

-

692

$11.001

-

-

-

Vyrian

USA . 8,637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,637

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 819 parts In-Stock

1+ parts

$10.422

100+ parts

-

1k+ parts

-

10k+ parts

-

819

$10.422

-

-

-

Corohmni

South Africa . 474 parts In-Stock

1+ parts

$11.580

100+ parts

-

1k+ parts

-

10k+ parts

-

474

$11.580

-

-

-

SupplyDigital Components

Austria . 7,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,331

-

-

-

-

Kulean Microsystems

USA . 6,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,096

-

-

-

-

Problanco Electronics

Mexico . 5,298 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,298

-

-

-

-

TANS Electronics

Latvia . 1,243 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,243

-

-

-

-

Microchip USA

USA . 228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

228

-

-

-

-

UHIMA Technologies

Türkiye . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14

-

-

-

-

Overview

Unlock endless possibilities with the LC823450XATBG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. This consumer IC is perfect for a wide range of applications, offering unmatched value and benefits to our customers. Experience seamless integration, high performance, and innovative solutions with the LC823450XATBG. Elevate your projects to new heights with this exceptional product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good insulation and protection for the IC, ensuring reliable performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Package Shape: RECTANGULAR

Rectangular shape makes it compatible with standard PCB layouts and designs.

General IC Type: CONSUMER CIRCUIT

Designed for consumer electronics applications, ensuring compatibility and reliable performance in consumer devices.

No. of Terminals: 154

High number of terminals allows for complex connectivity options and functionalities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array design with very thin profile and fine pitch enables high density integration and space-saving on PCBs.

Maximum Operating Temperature: 65 °C

High maximum operating temperature ensures stability and reliability in various operating conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures functionality in a wide range of environmental conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper terminal finish ensures good conductivity and corrosion resistance for long-term performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy connection and integration into circuit boards.

Maximum Seated Height: 0.73 mm

Low maximum seated height allows for compact and slim device designs.

Width: 5.33 mm

Narrow width enables space-efficient placement on PCBs.

Minimum Supply Voltage (Vsup): 0.93 V

Low minimum supply voltage requirement allows for efficient power usage in devices.

Length: 5.52 mm

Compact length enables space-saving designs in electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures standard performance in typical operating conditions.

Terminal Form: BALL

Ball terminal form provides reliable connection and soldering points on PCBs.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables high-density interconnectivity and miniaturization in device designs.

Maximum Supply Voltage (Vsup): 1.27 V

Moderate maximum supply voltage capability allows for flexibility in power supply configurations.

Technical Specifications

Other Function Consumer ICs LC823450XATBG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B154

JESD-609 Code:

e1

Length:

5.52 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

154

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA154,12X13,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.73 mm

Maximum Supply Voltage (Vsup):

1.27 V

Minimum Supply Voltage (Vsup):

.93 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

5.33 mm

Trade Compliance

LC823450XATBG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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