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LC823425-13W1-E

Onsemi

LC823425-13W1-E by Onsemi

LC823425-13W1-E by Onsemi is a consumer circuit IC with 221 terminals in a square grid array package. It operates b/w -20 to 75 °C, with power supplies of 1/1.2V and 1.8/3.3V, making it suitable for various consumer electronic applications requiring low profile and fine pitch components.

Median Price

$16.480

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,360 parts In-Stock

1+ parts

-

100+ parts

$16.480

1k+ parts

$16.480

10k+ parts

$16.480

3,360

-

$16.480

$16.480

$16.480

Flip Electronics (Authorized)

USA . 3,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,360

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,536 parts In-Stock

1+ parts

$16.480

100+ parts

-

1k+ parts

-

10k+ parts

-

1,536

$16.480

-

-

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Flip Electronics

USA . 3,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,360

-

-

-

-

Digiode

USA . 1,272 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,272

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 372 parts In-Stock

1+ parts

$16.480

100+ parts

-

1k+ parts

-

10k+ parts

-

372

$16.480

-

-

-

SupplyDigital Components

Austria . 5,943 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,943

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-

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Problanco Electronics

Mexico . 3,644 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,644

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-

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Kulean Microsystems

USA . 1,459 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,459

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-

-

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TANS Electronics

Latvia . 1,125 parts In-Stock

1+ parts

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100+ parts

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1,125

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Corphita

USA . 758 parts In-Stock

1+ parts

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758

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Microchip USA

USA . 376 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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376

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UHIMA Technologies

Türkiye . 28 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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28

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Overview

Experience the superior quality and reliability of the LC823425-13W1-E by Onsemi, a leading manufacturer in the industry. This innovative consumer IC offers versatile applications with its cutting-edge technology and precise design. Enhance your products with the value and benefits that this high-performance circuit provides, from power supplies to general consumer electronics. Trust in Onsemi for unmatched quality and performance, setting new standards in the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easier and more compact assembly of electronic components.

Package Shape: SQUARE

The square package shape helps optimize space utilization on circuit boards.

Power Supplies (V): 1/1.2,1.8/3.3

The multiple power supply options provide flexibility for different voltage requirements in consumer electronics.

No. of Terminals: 221

The large number of terminals allows for connectivity to a wide range of devices and peripherals.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature makes the product suitable for use in a variety of climates and conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish ensures good conductivity and corrosion resistance.

Width: 11 mm

The compact width allows for efficient use of space in electronic devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Other Function Consumer ICs LC823425-13W1-E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Additional Features:

ALSO REQUIRES 1.1 TO 1.3 V

General IC Type:

JESD-30 Code:

S-PBGA-B221

JESD-609 Code:

e1

Length:

11 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

221

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA221,16X16,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.1 V

Minimum Supply Voltage (Vsup):

.93 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11 mm

Trade Compliance

LC823425-13W1-E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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