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LC823410-10R

Onsemi

LC823410-10R by Onsemi

LC823410-10R by Onsemi is a consumer IC with 120 terminals in a flatpack, thin profile package. It operates b/w -30 °C to 70°C and has a supply voltage range of 1.05V to 1.2V. This CMOS technology IC is suitable for various consumer circuit applications requiring precise performance in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,705 parts In-Stock

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Digiode

USA . 886 parts In-Stock

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886

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SupplyDigital Components

Austria . 6,775 parts In-Stock

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TANS Electronics

Latvia . 6,609 parts In-Stock

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Problanco Electronics

Mexico . 1,857 parts In-Stock

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Kulean Microsystems

USA . 710 parts In-Stock

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UHIMA Technologies

Türkiye . 553 parts In-Stock

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Corphita

USA . 431 parts In-Stock

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Corohmni

South Africa . 156 parts In-Stock

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Overview

Unleash the power of innovation with the LC823410-10R by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality consumer ICs that redefine user experiences. This versatile product opens up a world of possibilities in various applications, offering unparalleled value and benefits to customers. Experience seamless integration, enhanced performance, and cutting-edge technology with the LC823410-10R. Elevate your projects to new heights with this game-changing solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on the circuit board, allowing for more compact designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliability and performance in consumer electronic devices.

No. of Terminals: 120

Having 120 terminals provides flexibility for connecting to various components, enhancing the IC's functionality.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style offers high-density mounting and efficient thermal management.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the IC can withstand demanding environmental conditions without performance degradation.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows the IC to operate reliably even in cold environments.

Terminal Position: QUAD

Quad terminal position provides stable connectivity and enhances the IC's performance in multi-functional applications.

Maximum Seated Height: 1.2 mm

The low seated height makes the IC suitable for compact designs and contributes to space-saving benefits.

Width: 14 mm

The width of 14 mm offers compatibility with standard board layouts and facilitates ease of integration.

Minimum Supply Voltage (Vsup): 1.05 V

The low minimum supply voltage requirement ensures energy efficiency and extends battery life in portable devices.

Length: 14 mm

The length of 14 mm complements the square package shape, helping in efficient board layout and space optimization.

Technology: CMOS

The CMOS technology used in the IC offers low power consumption and high noise immunity, enhancing performance and reliability.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical connection and facilitates easy soldering during assembly.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4 mm allows for precise connections and contributes to high-density mounting on the PCB.

Maximum Supply Voltage (Vsup): 1.2 V

The maximum supply voltage of 1.2 V ensures safe operation of the IC within specified voltage limits to prevent damage.

Technical Specifications

Other Function Consumer ICs LC823410-10R attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 1.35 TO 1.65 V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

No. of Functions:

1

No. of Terminals:

120

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

1.2 V

Minimum Supply Voltage (Vsup):

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LC823410-10R General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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