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LC823455XATBG

Onsemi

LC823455XATBG by Onsemi

LC823455XATBG by Onsemi is a consumer IC with 120 terminals in a square grid array package. It operates b/w -20 °C to 65°C, with supply voltage ranging from 0.95V to 1.155V. This IC is ideal for applications requiring fine pitch and thin profile designs in consumer circuits.

Median Price

$7.060

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,000 parts In-Stock

1+ parts

$6.624

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$6.624

-

-

-

Verical

USA . 1,000 parts In-Stock

1+ parts

$6.624

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$6.624

-

-

-

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$7.430

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$7.430

-

-

-

Farnell

UK . 1,000 parts In-Stock

1+ parts

$8.500

100+ parts

$6.310

1k+ parts

$5.440

10k+ parts

-

1,000

$8.500

$6.310

$5.440

-

DigiKey

USA . 72,000 parts In-Stock

1+ parts

-

100+ parts

$6.800

1k+ parts

-

10k+ parts

-

72,000

-

$6.800

-

-

Flip Electronics (Authorized)

USA . 72,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

72,000

-

-

-

-

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$7.320

1k+ parts

$6.550

10k+ parts

$6.170

1,000

-

$7.320

$6.550

$6.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,055 parts In-Stock

1+ parts

$6.441

100+ parts

-

1k+ parts

-

10k+ parts

-

1,055

$6.441

-

-

-

Vyrian

USA . 869 parts In-Stock

1+ parts

$6.780

100+ parts

-

1k+ parts

-

10k+ parts

-

869

$6.780

-

-

-

Flip Electronics

USA . 72,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

72,000

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Bristol Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Dan-Mar Components

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 124 parts In-Stock

1+ parts

$6.102

100+ parts

-

1k+ parts

-

10k+ parts

-

124

$6.102

-

-

-

Corohmni

South Africa . 360 parts In-Stock

1+ parts

$6.780

100+ parts

-

1k+ parts

-

10k+ parts

-

360

$6.780

-

-

-

Continental Prestige Electronics

USA . 1,000 parts In-Stock

1+ parts

$8.500

100+ parts

$6.310

1k+ parts

$5.440

10k+ parts

-

1,000

$8.500

$6.310

$5.440

-

Problanco Electronics

Mexico . 7,074 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,074

-

-

-

-

TANS Electronics

Latvia . 4,291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,291

-

-

-

-

SupplyDigital Components

Austria . 1,113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,113

-

-

-

-

UHIMA Technologies

Türkiye . 881 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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881

-

-

-

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Microchip USA

USA . 298 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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298

-

-

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Kulean Microsystems

USA . 49 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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49

-

-

-

-

Overview

Experience unparalleled quality and innovation with the LC823455XATBG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge technology with a focus on reliability and performance. This consumer IC offers a wide range of applications, making it versatile for various electronic devices. With a compact package design and advanced features, this product provides exceptional value and benefits to customers seeking superior functionality and efficiency. Trust Onsemi to elevate your electronics experience with the LC823455XATBG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and thermal resistance, making the product suitable for a wide range of operating environments.

Surface Mount: YES

Surface mount technology makes it easier and more efficient to assemble and integrate the product into electronic systems.

Package Shape: SQUARE

Square shape allows for more efficient use of space and better fitting into compact electronic devices.

Maximum Operating Temperature: 65 °C

With a maximum operating temperature of 65 °C, this product can withstand high temperature environments without impacting performance.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20 °C, this product can operate reliably in cold temperature conditions as well.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connections to other components in the system.

Minimum Supply Voltage (Vsup): 0.95 V

Low minimum supply voltage requirement of 0.95 V ensures efficient power consumption and compatibility with a wide range of power sources.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that the product meets standard performance requirements for commercial applications.

Terminal Form: BALL

Ball terminal form offers reliable connectivity and better soldering capabilities for seamless integration into electronic circuitry.

Terminal Pitch: 0.35 mm

Fine terminal pitch of 0.35 mm allows for high-density packaging and precise connections, suitable for intricate circuit designs.

Maximum Supply Voltage (Vsup): 1.155 V

Maximum supply voltage of 1.155 V provides a safe operating range and protects the product from voltage spikes or overloads.

Technical Specifications

Other Function Consumer ICs LC823455XATBG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 1.05 TO 1.155 V SUPPLY

General IC Type:

JESD-30 Code:

R-PBGA-B120

Length:

4.086 mm

No. of Functions:

1

No. of Terminals:

120

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA120,11X11,14

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.66 mm

Maximum Supply Voltage (Vsup):

1.155 V

Minimum Supply Voltage (Vsup):

.95 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.086 mm

Trade Compliance

LC823455XATBG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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