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LC822973

Onsemi

LC822973 by Onsemi

LC822973 by Onsemi is a consumer IC with 84 terminals in a square chip carrier package. It operates b/w -30 °C to 85°C, with supply voltage ranging from 1.35V to 1.65V. This CMOS technology IC is suitable for various consumer circuit applications due to its compact size and surface-mount capability.

Median Price

$0.515

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$0.515

1k+ parts

$0.428

10k+ parts

$0.381

1

-

$0.515

$0.428

$0.381

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,953 parts In-Stock

1+ parts

$0.401

100+ parts

-

1k+ parts

-

10k+ parts

-

1,953

$0.401

-

-

-

Vyrian

USA . 6,702 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,702

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,096 parts In-Stock

1+ parts

$0.380

100+ parts

-

1k+ parts

-

10k+ parts

-

2,096

$0.380

-

-

-

Corohmni

South Africa . 327 parts In-Stock

1+ parts

$0.422

100+ parts

-

1k+ parts

-

10k+ parts

-

327

$0.422

-

-

-

Problanco Electronics

Mexico . 7,524 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,524

-

-

-

-

TANS Electronics

Latvia . 4,949 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,949

-

-

-

-

SupplyDigital Components

Austria . 3,655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,655

-

-

-

-

Kulean Microsystems

USA . 2,548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,548

-

-

-

-

UHIMA Technologies

Türkiye . 220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

220

-

-

-

-

Overview

Transform the way you experience consumer electronics with the LC822973 by Onsemi. Known for their superior quality and innovative technology, Onsemi delivers cutting-edge solutions in the Other Function Consumer ICs category. This surface-mount chip carrier offers a very thin profile and a quad terminal position, making it ideal for a wide range of applications. With a minimum supply voltage of 1.35V and maximum operating temperature of 85 °C, this product provides unmatched performance and reliability. Elevate your projects with the LC822973 and unlock endless possibilities in consumer electronics.

Feature Benefit Bullets

Surface Mount: YES

Easy to install on a PCB, allowing for automated assembly processes.

Package Shape: SQUARE

Compact design making it suitable for space-constrained applications.

General IC Type: CONSUMER CIRCUIT

Designed for consumer electronic devices, ensuring compatibility and functionality in a wide range of applications.

No. of Terminals: 84

Provides ample connectivity options for integration into complex electronic systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Efficient heat dissipation, low profile for space-saving, and robust packaging for durability.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under high temperature conditions.

Minimum Operating Temperature: -30 °C

Wide temperature range for operation in various environments.

Terminal Position: QUAD

Quad terminal configuration for improved connectivity and signal transmission.

Maximum Seated Height: 0.95 mm

Low profile design suitable for compact electronic devices.

Width: 10 mm

Compact width for easy integration into electronic assemblies.

Minimum Supply Voltage (Vsup): 1.35 V

Low minimum supply voltage for energy-efficient operation.

Length: 10 mm

Compact length ideal for space-constrained applications.

Technology: CMOS

CMOS technology offers low power consumption and reliable performance.

Terminal Form: NO LEAD

Lead-free terminals for environmentally friendly and RoHS compliant design.

Terminal Pitch: 0.4 mm

Fine terminal pitch for high-density mounting and connectivity.

Maximum Supply Voltage (Vsup): 1.65 V

Safe maximum supply voltage for stable and reliable operation.

Technical Specifications

Other Function Consumer ICs LC822973 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT ANALOG SUPPLY 1.35 TO 1.65; ALSO AVAILABLE IN BGA PACKAGE

General IC Type:

JESD-30 Code:

S-XQCC-N84

Length:

10 mm

No. of Functions:

1

No. of Terminals:

84

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.95 mm

Maximum Supply Voltage (Vsup):

1.65 V

Minimum Supply Voltage (Vsup):

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

LC822973 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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